PRECAUTIONS
281
FERRITE
PRODUCTS
5
Technical considerations
Stages
Precautions
6/7
2. Cleaning conditions should be determined after verify-
ing, through a test run, that the cleaning process does
not affect the inductor's characteristics.
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may
detrimentally affect the performance of the inductors.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause
excessive vibration of the PC board which may lead to the cracking of the
inductor or the soldered portion, or decrease the terminal electrodes' strength.
Thus the following conditions should be carefully checked;
Ultrasonic output
Below 20 w/
b
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
5.Cleaning
7. Handling
S
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors
and other components, care is required so as not to
give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by
using the appropriate devices.
S
General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and mag-
netic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors (soldering irons,
measuring instruments) should be properly grounded.
5. Keep bare hands and metal products (i.e., metal desk)
away from chip electrodes or conductive areas that lead
to chip electrodes.
6. Keep inductors away from items that generate mag-
netic fields such as speakers or coils.
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Mechanical considerations
1. Be careful not to subject the inductors to excessive
mechanical shocks.
(1) If inductors are dropped on the floor or a hard surface
they should not be used.
(2)When handling the mounted boards, be careful that
the mounted components do not come in contact with
or bump against other boards or components.
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Application of resin coatings, moldings, etc. to the PCB
and components.
1. With some type of resins a decomposition gas or chemi-
cal reaction vapor may remain inside the resin during
the hardening period or while left under normal storage
conditions resulting in the deterioration of the inductor's
performance.
2. When a resin's hardening temperature is higher than
the inductor's operating temperature, the stresses gen-
erated by the excess heat may lead to inductor dam-
age or destruction.
3. Stress caused by a resin’s temperature generated ex-
pansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not rec-
ommended.
6. Post cleaning processes
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads