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參數(shù)資料
| 型號(hào)： | FBMH4532HM202NT |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類(lèi)： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 1.5 A, FERRITE CHIP |
| 文件頁(yè)數(shù)： | 27/67頁(yè) |
| 文件大?。?/td> | 5322K |
| 代理商： | FBMH4532HM202NT |
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PRECAUTIONS
275
FERRITE
PRODUCTS
5
3/7
Technical considerations
Stages
Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed
on the inductors, causing damage. To avoid this, the following points should
be considered before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of
the PC board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-
up nozzle, supporting pins or back-up pins should be used under the PC board.
The following diagrams show some typical examples of good pick-up nozzle
placement:
Improper method
Proper method
2. As the alignment pin wears out, adjustment of the nozzle height can cause
chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin
in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
S
Selection of Adhesives
1. Mounting inductors with adhesives in preliminary as-
sembly, before the soldering stage, may lead to de-
graded inductor characteristics unless the following
factors are appropriately checked; the size of land pat-
terns, type of adhesive, amount applied, hardening tem-
perature and hardening period. Therefore, it is impera-
tive to consult the manufacturer of the adhesives on
proper usage and amounts of adhesive to use.
1. Some adhesives may cause reduced insulation resistance. The difference
between the shrinkage percentage of the adhesive and that of the inductors
may result in stresses on the inductors and lead to cracking. Moreover, too
little or too much adhesive applied to the board may adversely affect compo-
nent placement, so the following precautions should be noted in the applica-
tion of adhesives.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the
mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
3.Considerations for
automatic placement
S
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the
inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should
be conducted periodically.
Double-sided
mounting
Single-sided mounting
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FBMH4532HM202-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 FER BD HI CUR CHIP 1812 2000OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類(lèi)型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FBMH4532HM681K | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
| FBMH4532HM681T | 制造商:TAIYO YUDE 功能描述:RoHS Compliant |
| FBMH4532HM681-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 FER BD HI CUR CHIP 1812 680OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類(lèi)型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FBMH4532HM681-T | 制造商:TAIYO YUDEN 功能描述:Ferrite Chip Bead |
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