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參數(shù)資料
| 型號： | FBMH4532HM202NT |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 1.5 A, FERRITE CHIP |
| 文件頁數(shù)： | 26/67頁 |
| 文件大小： | 5322K |
| 代理商： | FBMH4532HM202NT |
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PRECAUTIONS
273
FERRITE
PRODUCTS
5
(2) Examples of good and bad solder application
Not recommended
Recommended
2.PCB Design
Not recommended
Recommended
Deflection of
the board
Mixed mounting
of SMD and
leaded compo-
nents
Component
placement close
to the chassis
Hand-soldering
of leaded com-
ponents near
mounted compo-
nents
Horizontal com-
ponent place-
ment
S
Pattern configurations
(Inductor layout on panelized [breakaway] PC boards)
1. After inductors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes (PCB cutting, board inspec-
tion, mounting of additional parts, assembly into the
chassis, wave soldering the reflow soldered boards etc.)
For this reason, planning pattern configurations and
the position of SMD inductors should be carefully per-
formed to minimize stress.
1-1. The following are examples of good and bad inductor layout; SMD inductors
should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item
1-2. To layout the inductors for the breakaway PC board, it should be noted that
the amount of mechanical stresses given will vary depending on inductor
layout. An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechani-
cal stress on the inductors can vary according to the method used.
The
following methods are listed in order from least stressful to most stressful:
push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor
layout must also consider the PCB splitting procedure.
2/7
Stages
Precautions
Technical considerations
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FBMH4532HM202-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 FER BD HI CUR CHIP 1812 2000OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FBMH4532HM681K | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
| FBMH4532HM681T | 制造商:TAIYO YUDE 功能描述:RoHS Compliant |
| FBMH4532HM681-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 FER BD HI CUR CHIP 1812 680OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FBMH4532HM681-T | 制造商:TAIYO YUDEN 功能描述:Ferrite Chip Bead |
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