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參數(shù)資料
| 型號： | FAN5019MTCX_NL |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING CONTROLLER, 4000 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封裝： | LEAD FREE, TSSOP-28 |
| 文件頁數(shù)： | 21/30頁 |
| 文件大?。?/td> | 781K |
| 代理商： | FAN5019MTCX_NL |
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FAN5019
PRODUCT SPECIFICATION
28
REV. 1.0.7 1/5/04
Whenever a power dissipating component (e.g., a power
MOSFET) is soldered to a PCB, the liberal use of vias,
both directly on the mounting pad and immediately
surrounding it, is recommended. Two important reasons
for this are: improved current rating through the vias, and
improved thermal performance from vias extended to the
opposite side of the PCB where a plane can more readily
transfer the heat to the air. Make a mirror image of any
pad being used to heatsink the MOSFETs on the opposite
side of the PCB to achieve the best thermal dissipation to
the air around the board. To further improve thermal
performance, the largest possible pad area should be used.
The output power path should also be routed to
encompass a short distance. The output power path is
formed by the current path through the inductor, the
output capacitors, and the load.
For best EMI containment, a solid power ground plane
should be used as one of the inner layers extending fully
under all the power components.
Signal Circuitry
The output voltage is sensed and regulated between the
FB pin and the FBRTN pin (which connects to the signal
ground at the load). In order to avoid differential mode
noise pickup in the sensed signal, the loop area should be
small. Thus the FB and FBRTN traces should be routed
adjacent to each other atop the power ground plane back
to the controller.
The feedback traces from the switch nodes should be
connected as close as possible to the inductor. The CSREF
signal should be connected to the output voltage at the
nearest inductor to the controller.
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