參數(shù)資料
型號(hào)： EPF10K200S
英文描述： Programmable Logic
中文描述： 可編程邏輯
文件頁數(shù)： 88/138頁
文件大?。?/td> 2116K
代理商： EPF10K200S
Altera Corporation
53
FLEX 10K Embedded Programmable Logic Family Data Sheet
Timing Model
The continuous, high-performance FastTrack Interconnect routing
resources ensure predictable performance and accurate simulation and
timing analysis. This predictable performance contrasts with that of
FPGAs, which use a segmented connection scheme and therefore have
unpredictable performance.
Device performance can be estimated by following the signal path from a
source, through the interconnect, to the destination. For example, the
registered performance between two LEs on the same row can be
calculated by adding the following parameters:
s
LE register clock-to-output delay (tCO)
s
Interconnect delay (tSAMEROW)
s
LE look-up table delay (tLUT)
s
LE register setup time (tSU)
The routing delay depends on the placement of the source and destination
LEs. A more complex registered path may involve multiple combinatorial
LEs between the source and destination LEs.
Timing simulation and delay prediction are available with the
MAX+PLUS II Simulator and Timing Analyzer, or with industry-
standard EDA tools. The Simulator offers both pre-synthesis functional
simulation to evaluate logic design accuracy and post-synthesis timing
simulation with 0.1-ns resolution. The Timing Analyzer provides point-
to-point timing delay information, setup and hold time analysis, and
device-wide performance analysis.
Figure 24 shows the overall timing model, which maps the possible paths
to and from the various elements of the FLEX 10K device.
Figure 24. FLEX 10K Device Timing Model
Dedicated
Clock/Input
Interconnect
I/O Element
Logic
Element
Embedded Array
Block
相關(guān)PDF資料
PDF描述
EPF10K130EFC484-3 Field Programmable Gate Array (FPGA)
EPF10K130EFC672-1 Field Programmable Gate Array (FPGA)
EPF10K130EFC672-1X Field Programmable Gate Array (FPGA)
EPF10K130EFC672-2 Field Programmable Gate Array (FPGA)
EPF10K200EBC600-2 Field Programmable Gate Array (FPGA)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K200SBC356-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*