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參數(shù)資料
| 型號(hào)： | DSPA56720AG |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
| 中文描述： | SymphonyTM DSP56720 / DSP56721多核音頻處理器 |
| 文件頁數(shù)： | 10/54頁 |
| 文件大小： | 671K |
| 代理商： | DSPA56720AG |
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Symphony
TM
DSP56720 / DSP56721 Multi-Core Audio Processors, Rev.1
Freescale Semiconductor
10
2.1.2
Thermal Characteristics
For thermal characteristics, see
Table 5
.
2.1.3
Power Requirements
To prevent high current conditions due to possible improper sequencing of the power supplies, use an external Schottky diode
as shown in
Figure 6
, connected between the DSP56720/DSP56721 IO_VDD and Core_VDD power pins.
Figure 6. Prevent High Current Conditions by Using External Schottky Diode
If an external Schottky diode is not used (to prevent a high current condition at power-up), then IO_VDD must be applied ahead
of Core_VDD, as shown in
Figure 7
.
Figure 7. Prevent High Current Conditions by Applying IO_VDD Before Core_VDD
For correct operation of the internal power-on reset logic, the Core_VDD ramp rate (Tr) to full supply must be less than 10 ms,
as shown in
Figure 8
.
Table 5. Thermal Characteristics
Characteristic
Board Type
Symbol
LQFP Values
Unit
°
C/W
Natural Convection, Junction-to-ambient thermal resistance
1,2
Single layer board
(1s)
R
θ
JA
or
θ
JA
57 for 80 QFP
49 for 144 QFP
Four layer board
(2s2p)
44 for 80 QFP
40 for 144 QFP
°
C/W
Junction-to-case thermal resistance
3
–
R
θ
JC
or
θ
JC
10 for 80 QFP
9 for 144 QFP
°
C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1).
2.
3.
IO_VDD
Core_VDD
External
Schottky
Diode
Core_VDD
IO_VDD
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DSPA56721AF | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
| DSPA56721AG | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
| DSPB56720AG | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
| DSPB56721AF | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
| DSPB56721AG | SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSPA56721AF | 制造商:Freescale Semiconductor 功能描述:DSP FIXED-POINT 24-BIT 200MHZ 200MIPS 80-PIN LQFP TRAY - Bulk |
| DSPA56721AG | 制造商:Freescale Semiconductor 功能描述:AUD PROCESSOR 144LQFP - Bulk |
| DSPASMRM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP Assembler Reference Manual |
| DSPAUDIOEVMMB1 | 功能描述:開發(fā)板和工具包 - 其他處理器 DSP563XX MOTHER BOARD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| DSPAUDIOEVMMB1E | 功能描述:音頻 IC 開發(fā)工具 DSP563XX MOTHERBOARD RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
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