參數(shù)資料
型號： DSP56F807VF80
廠商： Freescale Semiconductor
文件頁數(shù)： 52/60頁
文件大?。?/td> 0K
描述： IC DSP 80MHZ 60K FLASH 160-BGA
標準包裝： 126
系列： 56F8xx
核心處理器： 56800
芯體尺寸： 16-位
速度： 80MHz
連通性： CAN，EBI/EMI，SCI，SPI
外圍設(shè)備： POR，PWM，WDT
輸入/輸出數(shù)： 32
程序存儲器容量： 136KB（68K x 16）
程序存儲器類型： 閃存
RAM 容量： 6K x 16
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 160-BGA
包裝： 托盤
56F807 Technical Data Technical Data, Rev. 16
56
Freescale Semiconductor
Measure the thermal resistance from the junction to where the leads are attached to the case. This definition
is approximately equal to a junction to board thermal resistance.
Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package case
determined by a thermocouple.
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
5.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation:
Provide a low-impedance path from the board power supply to each VDD pin on the controller, and from the
board ground to each VSS pin.
The minimum bypass requirement is to place 0.1
μF capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
performance tolerances.
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than maximum
rated voltages to this high-impedance circuit. Reliability
of operation is enhanced if unused inputs are tied to an
appropriate voltage level.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSP56F807VF80E 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56F807VF80E 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor IC
DSP56F807VF80J 制造商:Freescale Semiconductor 功能描述:DSP 16BIT - Trays
DSP56F826 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
DSP56F826-827UM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Digital Signal Processor Users Manual
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