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參數(shù)資料
| 型號(hào)： | DSP56F801 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | 16-bit Hybrid Controller(16位混合控制器) |
| 中文描述： | 16位混合控制器（16位混合控制器） |
| 文件頁數(shù)： | 13/44頁 |
| 文件大?。?/td> | 858K |
| 代理商： | DSP56F801 |
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General Characteristics
56F801 Technical Data
13
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
R
θ
JA
) was simulated to be equivalent to the
JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was
also simulated on a thermal test board with two internal planes (2s2p where s is the number of signal
layers and p is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA
for forced convection or with the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
θ
JC
), was simulated to be equivalent to the measured
values using the cold plate technique with the cold plate temperature used as the "case" temperature.
The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This
is the correct thermal metric to use to calculate thermal performance when the package is being used
with a heat sink.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT
), is the "resistance" from junction to reference
point thermocouple on top center of case as defined in JESD51-2.
Ψ
JT
is a useful value to use to
estimate junction temperature in steady state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance,
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other
components on the board, and board thermal resistance.
See Section 5.1 from more details on thermal design considerations.
2.
3.
4.
5.
6.
Table 16. Thermal Characteristics
6
Characteristic
Comments
Symbol
Value
Unit
Notes
48-pin LQFP
Junction to ambient
Natural convection
R
θ
JA
50.6
°C/W
2
Junction to ambient (@1m/sec)
R
θ
JMA
47.4
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
R
θ
JMA
(2s2p)
39.1
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
R
θ
JMA
37.9
°C/W
1,2
Junction to case
R
θ
JC
17.3
°C/W
3
Junction to center of case
Ψ
JT
1.2
°C/W
4, 5
I/O pin power dissipation
P
I/O
User Determined
W
Power dissipation
P
D
P
D
= (I
DD
x V
DD
+ P
I/O
)
W
Junction to center of case
P
DMAX
(TJ - TA) /
θ
JA
°C
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| DSP56F801-7UM | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
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| DSP56F801EVM | 功能描述:開發(fā)板和工具包 - 其他處理器 Evaluation Kit For DSP56F801 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| DSP56F801EVMUM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56F801 Evaluation Module Hardware User＇s Manual |
| DSP56F801FA60 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 60Mhz/30MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
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