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參數(shù)資料
| 型號： | DS1920 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Temperature Button(溫度按鈕) |
| 文件頁數(shù)： | 42/52頁 |
| 文件大?。?/td> | 881K |
| 代理商： | DS1920 |
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AD14160/AD14160L
–42–
REV. A
Thermal Characteristics
The AD14160/AD14160L is packaged in a 452-lead ceramic
ball grid array (CBGA). The package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. The AD14160/AD14160L is specified for a
case temperature (T
CASE
). Design of the mounting surface and
attachment material should be such that T
CASE
is not exceeded.
θ
JC
= 0.36
°
C/W
Thermal Cross-Section
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. The top
layer of the package, where the die are mounted, is a metal V
DD
layer. The approximate metal area coverage from the metal
planes and routing layers is estimated below.
Thermal Conductivity
Thermal Conductivity
W/cm
8
C
Material
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
0.18
0.14
1.78
0.03
1.45
CERAMIC LAYER 4 MILS
CERAMIC LAYER 28 MILS
(2 LAYERS 14 MILS EACH)
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
SEAL RING METALIZATION
SILICON DIE
19 MILS
THERMOPLASTIC
THICKNESS 5 MILS
V
DD
SIG2
SIG3
GND
SIG4
SIG5
BASE
KOVAR SEAL RING
HEIGHT = 50 MILS
KOVAR LID
0.015 IN
SUB-PAD
SIGI
DBGA PADS
Figure 41.
Metal Coverage Per Layer
Percent Metal
(1 Mil Thick)
Layer
V
DD
SIG2
SIG3
GND
SIG4
SIG5
BASE
87
12
12
89
14
13
91
(Assume Uniformly Distributed)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS1920+F5 | 制造商:Maxim Integrated Products 功能描述:TEMP IBTN 2PIN F5 MICROCAN - Rail/Tube |
| DS1920-F3 | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:Temperature iButton |
| DS1920-F5 | 功能描述:iButton RoHS:否 存儲類型:SRAM 存儲容量:512 B 組織: 工作電源電壓:3 V to 5.25 V 接口類型:1-Wire 最大工作溫度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封裝 / 箱體:F5 MicroCan 制造商:Maxim Integrated |
| DS1920-F5+ | 功能描述:iButton Temperature iButton RoHS:否 存儲類型:SRAM 存儲容量:512 B 組織: 工作電源電壓:3 V to 5.25 V 接口類型:1-Wire 最大工作溫度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封裝 / 箱體:F5 MicroCan 制造商:Maxim Integrated |
| DS1921 | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:High-Resolution Thermochron iButton |
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