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| 型號(hào)： | DEMO56F8014 |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 25/124頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD DEMO MC56F8014 W/US PS |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | 56F8014 |
| 所含物品： | 板，線纜，CD，電源 |
| 配用： | APMOTOR56F8000E-ND - KIT DEMO MOTOR CTRL SYSTEM |
| 相關(guān)產(chǎn)品： | MC56F8014VFAE-ND - IC DIGITAL SIGNAL CTRLR 32-LQFP |
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56F8014 Technical Data, Rev. 11
120
Freescale Semiconductor
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where
:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where
:
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where
:
TA
=
Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (
oC/W)
PD
=
Power dissipation in the package (W)
RθJA = Package junction-to-ambient thermal resistance (°C/W)
RθJC = Package junction-to-case thermal resistance (°C/W)
RθCA = Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VE-BTR-EY-F2 | CONVERTER MOD DC/DC 7.5V 50W |
| VE-BTR-EY-F1 | CONVERTER MOD DC/DC 7.5V 50W |
| VE-BTR-EX-S | CONVERTER MOD DC/DC 7.5V 75W |
| VE-BTR-EW-S | CONVERTER MOD DC/DC 7.5V 100W |
| VE-BTM-EY-F4 | CONVERTER MOD DC/DC 10V 50W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| DEMO56F8014-E | 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MC56F8014 BD W/UNIV PS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| DEMO56F8014-EE | 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MC56F8014 BD W/UNIV PS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| DEMO90121DA | 功能描述:KIT DEMO RFID DOOR ACCESS RoHS:是 類別:RF/IF 和 RFID >> 過(guò)時(shí)/停產(chǎn)零件編號(hào) 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 類型:用于 200/300 系列的歐盟開(kāi)發(fā)套件 適用于相關(guān)產(chǎn)品:Zensys RF 模塊 所含物品:開(kāi)發(fā)板，模塊，編程器，軟件，線纜，電源 其它名稱:703-1019Q3225667 |
| DEMO90121LR | 功能描述:KIT DEMO LONG RANGE READER RoHS:是 類別:RF/IF 和 RFID >> RFID 評(píng)估和開(kāi)發(fā)套件及電路板 系列:- 產(chǎn)品培訓(xùn)模塊:M24LR64 Dual Interface EEPROM 標(biāo)準(zhǔn)包裝:1 系列:- 類型:讀取器模塊 頻率:13.56MHz 適用于相關(guān)產(chǎn)品:M24LR-64-R 已供物品:2 根基準(zhǔn)天線，I2C 和 RFID 讀取器，樣品 其它名稱:497-10480 |
| DEMO908AP64 | 功能描述:開(kāi)發(fā)板和工具包 - S08 / S12 MC68HC908AP64 DEMO BRD RoHS:否 產(chǎn)品:Development Kits 工具用于評(píng)估:MC9S12G128 核心:S12 接口類型:CAN, LIN, RS-232, USB 工作電源電壓:5 V 制造商:Freescale Semiconductor |
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