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參數(shù)資料
| 型號(hào)： | DEM-VSP2262Y |
| 英文描述： | CCD SIGNAL PROCESSOR for DIGITAL CAMERAS |
| 中文描述： | CCD信號(hào)處理器的數(shù)碼相機(jī) |
| 文件頁(yè)數(shù)： | 12/13頁(yè) |
| 文件大?。?/td> | 224K |
| 代理商： | DEM-VSP2262Y |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LQFP
LQFP
Package
Drawing
PT
PT
Pins Package
Qty
250
2000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
VSP2262Y
VSP2262Y/2K
ACTIVE
ACTIVE
48
48
TBD
TBD
CU SNPB
CU SNPB
Level-1-235C-UNLIM
Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details.Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DEM-XTR501C | DEM-XTR501C - DISCONTINUED PRODUCT. No longer recommended for new design. |
| DENDROS-1 | |
| DENDROS-1G | |
| DENDROS-2 | |
| DEO125 | Fuse |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DEM-VSP3100Y | 制造商:Texas Instruments 功能描述:EVALUATION/DEMO BOARD FOR VSP3100Y - Bulk |
| DEMX-5W1P-1AON-K87 | 制造商:ITT Interconnect Solutions 功能描述:DEMX-5W1P-1AON-K87 - Bulk |
| DEMX5W1PK87 | 制造商:ITT 功能描述:DSUB 5W1 M PCR/A G50 T 制造商:ITT Interconnect Solutions 功能描述:DSUB 5W1 M PCR/A G50 T |
| DEMX9PK87 | 制造商:ITT Interconnect Solutions 功能描述:DSUB 9 M SOD M3 CLIN G TIN |
| DEM-XTR501C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DEM-XTR501C - DISCONTINUED PRODUCT. No longer recommended for new design. |
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