
87C51/80C51BH/80C31BH
Thermal Impedance
All thermal impedance data is approximate for static
air conditions at 1W of power dissipation. Values will
change depending on operating conditions and ap-
plications. See the Intel Packaging Handbook (Order
No. 240800) for a description of Intel’s thermal im-
pedance test methodology.
Package
i
JA
i
JC
Device
P
45
§
C/W
75
§
C/W
45
§
C/W
36
§
C/W
46
§
C/W
98
§
C/W
16
§
C/W
23
§
C/W
15
§
C/W
13
§
C/W
16
§
C/W
24
§
C/W
87C51
BH
87C51
BH
All
All
D
N
S
DATA SHEET REVISION HISTORY
Data sheets are changed as new device information
becomes available. Verify with your local Intel sales
office that you have the latest version before finaliz-
ing a design or ordering devices.
The following differences exist between this data-
sheet
(272335-003)
and
(272335-002):
1. Removed
b
20 and
b
3 spec, replaced with
b
24
spec.
2. Added
b
24 spec.
the
previous
version
3. 80C51BHP is replaced by 80C51BH with 64-byte
encryption table submitted and lock bit 1 set.
4. 80C51BH/80C31BH are now having some addi-
tional features as 87C51.
5. Revised PRST value and I
CC
idle values.
6. Added P3.3 control pin to programming and veri-
fication.
7. Added 80C51BH signature byte.
The following differences exist between the ‘‘-002’’
and the ‘‘-001’’ version of the 87C51/80C51BH/
80C31BH datasheet.
1. Removed
b
L, I
OL
e
g
10 mA from Float Wave-
forms figure.
2. Removed QP, QD and QN (commercial with ex-
tended burn-in) from Table 3. Prefix Identification.
This data sheet (272335-001) replaces the following:
80C51BH/80C31BH Express
80C51BHP
87C51/80C51BH/80C31BH
87C51 Express
87C51-20/-3
270218-003
270603-004
270147-008
270430-002
272082-002
21