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CYP15G0403DXB
CYV15G0403DXB
CYW15G0403DXB
Document #: 38-02065 Rev. *F
Page 44 of 45
Cypress Semiconductor Corporation, 2002-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagram
Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
HOTLink is a registered trademark and HOTLink II and MultiFrame are trademarks of Cypress Semiconductor. CPRI is a trademark
of Siemens AG. IBM and ESCON are registered trademarks, and FICON is a trademark, of International Business Machines. All
product and company names mentioned in this document may be the trademarks of their respective holders.
Ordering Information
Speed
Ordering Code
Package
Name
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
Package Type
Operating
Range
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Standard
Standard
Standard
Standard
OBSAI
OBSAI
Standard
Standard
Standard
Standard
OBSAI
OBSAI
CYP15G0403DXB-BGC
CYP15G0403DXB-BGI
CYV15G0403DXB-BGC
CYV15G0403DXB-BGI
CYW15G0403DXB-BGC
CYW15G0403DXB-BGI
CYP15G0403DXB-BGXC
CYP15G0403DXB-BGXI
CYV15G0403DXB-BGXC
CYV15G0403DXB-BGXI
CYW15G0403DXB-BGXC
CYW15G0403DXB-BGXI
256-Ball Thermally Enhanced Ball Grid Array
256-Ball Thermally Enhanced Ball Grid Array
256-Ball Thermally Enhanced Ball Grid Array
256-Ball Thermally Enhanced Ball Grid Array
256-Ball Thermally Enhanced Ball Grid Array
256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
A
B
0.15
C
0.15
C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
TOP OF MOLD COMPOUND
TO TOP OF BALLS
SEATING PLANE
SIDE VIEW
SECTION A-A
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
0.15 M C
0.30 M C
0.75±0.15(256X)
B
A
1
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
26°
TYP
A1 CORNER I.D.
0.50 MIN.
2
27.00±0.13
2
24.13
A1 CORNER I.D.
R 2.5 Max (4X)
1
51-85123-*E
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