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December 22, 2003
Document No. 38-12009 Rev. *D
3
Contents
SECTION A OVERVIEW
Features ...........................................................................................................................................13
Getting Started .................................................................................................................................14
Development Kits ................................................................................................................14
Tele-Training .......................................................................................................................14
Consultants .........................................................................................................................14
Technical Support ...............................................................................................................14
Application Notes ................................................................................................................14
Top-Level Architecture .....................................................................................................................15
Development Tools ..........................................................................................................................16
PSoC Designer Software Subsystems ................................................................................16
Hardware Tools ...................................................................................................................17
User Modules and Development Process ........................................................................................17
Ordering Information ........................................................................................................................19
Organization and Conventions .........................................................................................................20
Document Organization ......................................................................................................20
Document Conventions .......................................................................................................20
13
1. Pin Information
.......................................................................................................23
1.1
Pin Summary .......................................................................................................................23
1.2
Pinouts.................................................................................................................................24
2. Packaging Information
............................................................................................27
2.1
Packaging Dimensions.........................................................................................................27
2.2
Thermal Impedances ..........................................................................................................30
SECTION B CORE ARCHITECTURE
Top-Level Core Architecture ............................................................................................................31
Core Register Summary ...................................................................................................................32
31
3. CPU Core (M8C)
....................................................................................................35
3.1
Internal Registers.................................................................................................................35
3.2
Address Spaces...................................................................................................................35
3.3
Instruction Set Summary......................................................................................................37
3.4
Instruction Format ................................................................................................................38
3.4.1
One-Byte Instructions.....................................................................................38
3.4.2
Two-Byte Instructions.....................................................................................38
3.4.3
Three-Byte Instructions..................................................................................39
3.5
Addressing Modes ...............................................................................................................39
3.5.1
Source Immediate..........................................................................................39