參數(shù)資料
型號(hào): CY7C1462AV25
廠商: Cypress Semiconductor Corp.
英文描述: 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結(jié)構(gòu)的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
中文描述: 36兆位(1米x 36/2M x 18/512K × 72)流水線(xiàn)的SRAM架構(gòu)的總線(xiàn)延遲(帶總線(xiàn)延遲結(jié)構(gòu)的36兆位(1米x 36/2M x 18/512K × 72)流水線(xiàn)的SRAM)
文件頁(yè)數(shù): 23/27頁(yè)
文件大小: 465K
代理商: CY7C1462AV25
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Document #: 38-05354 Rev. *D
Page 23 of 27
250
CY7C1460AV25-250AXC
CY7C1462AV25-250AXC
CY7C1460AV25-250BZC
CY7C1462AV25-250BZC
CY7C1460AV25-250BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1462AV25-250BZXC
CY7C1464AV25-250BGC
51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
CY7C1464AV25-250BGXC
209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free
CY7C1460AV25-250AXI
51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
CY7C1462AV25-250AXI
CY7C1460AV25-250BZI
51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1462AV25-250BZI
CY7C1460AV25-250BZXI
51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1462AV25-250BZXI
CY7C1464AV25-250BGI
51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)
CY7C1464AV25-250BGXI
209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free
51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
Commercial
51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)
Industrial
Ordering Information
(continued)
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit
www.cypress.com
for actual products offered.
Speed
(MHz)
Ordering Code
Diagram
Package
Part and Package Type
Operating
Range
相關(guān)PDF資料
PDF描述
CY7C1460AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結(jié)構(gòu)的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結(jié)構(gòu)的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1462AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結(jié)構(gòu)的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1472V33-167AXI 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
CY7C1472V33-167BZXI 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1462AV25-167BZI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 36MB (2Mx18) 2.5v 167MHz 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1462AV25-200AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx18 2.5V NoBL PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1462AV25-200AXCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx18 2.5V NoBL PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1462AV25-250AXC 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Dual 2.5V 36M-Bit 2M x 18 2.6ns 100-Pin TQFP
CY7C1462AV33-167AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx18 3.3V NoBL PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray