參數(shù)資料
型號(hào): CY7C1316BV18
廠商: Cypress Semiconductor Corp.
英文描述: 18-Mbit DDR-II SRAM 2-Word Burst Architecture(2字Burst結(jié)構(gòu),18-Mbit DDR-II SRAM)
中文描述: 18兆位的DDR - II SRAM的2字突發(fā)架構(gòu)(2字突發(fā)結(jié)構(gòu),18 -兆位的DDR - II SRAM的)
文件頁(yè)數(shù): 25/28頁(yè)
文件大?。?/td> 469K
代理商: CY7C1316BV18
CY7C1316BV18
CY7C1916BV18
CY7C1318BV18
CY7C1320BV18
Document Number: 38-05621 Rev. *C
Page 25 of 28
Ordering Information
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit
www.cypress.com
for actual products offered.
Speed
(MHz)
Ordering Code
Diagram
167
CY7C1316BV18-167BZC
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1916BV18-167BZC
CY7C1318BV18-167BZC
CY7C1320BV18-167BZC
CY7C1316BV18-167BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free
CY7C1916BV18-167BZXC
CY7C1318BV18-167BZXC
CY7C1320BV18-167BZXC
CY7C1316BV18-167BZI
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1916BV18-167BZI
CY7C1318BV18-167BZI
CY7C1320BV18-167BZI
CY7C1316BV18-167BZXI
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free
CY7C1916BV18-167BZXI
CY7C1318BV18-167BZXI
CY7C1320BV18-167BZXI
200
CY7C1316BV18-200BZC
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1916BV18-200BZC
CY7C1318BV18-200BZC
CY7C1320BV18-200BZC
CY7C1316BV18-200BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free
CY7C1916BV18-200BZXC
CY7C1318BV18-200BZXC
CY7C1320BV18-200BZXC
CY7C1316BV18-200BZI
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1916BV18-200BZI
CY7C1318BV18-200BZI
CY7C1320BV18-200BZI
CY7C1316BV18-200BZXI
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free
CY7C1916BV18-200BZXI
CY7C1318BV18-200BZXI
CY7C1320BV18-200BZXI
250
CY7C1316BV18-250BZC
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1916BV18-250BZC
CY7C1318BV18-250BZC
CY7C1320BV18-250BZC
CY7C1316BV18-250BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free
CY7C1916BV18-250BZXC
CY7C1318BV18-250BZXC
CY7C1320BV18-250BZXC
Package
Package Type
Operating
Range
Commercial
Industrial
Commercial
Industrial
Commercial
相關(guān)PDF資料
PDF描述
CY7C1318BV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture(2字Burst結(jié)構(gòu),18-Mbit DDR-II SRAM)
CY7C192 64K x 4 Static RAM with Separate I/O(帶獨(dú)立的輸入/輸出口的64K x 4靜態(tài) RAM)
CY7C194B 256 Kb (64K x 4) Static RAM
CY7C194B-15PC 256 Kb (64K x 4) Static RAM
CY7C194B-15VC 256 Kb (64K x 4) Static RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C13181SC 制造商:Cypress Semiconductor 功能描述:
CY7C13181XC 制造商:Cypress Semiconductor 功能描述:
CY7C1318AV18-167BZC 制造商:Cypress Semiconductor 功能描述: 制造商:Rochester Electronics LLC 功能描述:
CY7C1318AV-200BZCES 制造商:Cypress Semiconductor 功能描述:
CY7C1318BV18-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx18 1.8V COM DDR II 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray