參數資料
型號: CY7C0852V
廠商: Cypress Semiconductor Corp.
英文描述: FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
中文描述: FLEx36TM 3.3 32K/64K/128K/256K × 36同步雙口RAM
文件頁數: 26/29頁
文件大?。?/td> 764K
代理商: CY7C0852V
CY7C0850V/CY7C0851V
CY7C0852V/CY7C0853V
Document #: 38-06070 Rev. *D
Page 26 of 29
Ordering Information
256K
×
36 (9M) 3.3V Synchronous CY7C0853V Dual-Port SRAM
Speed
(MHz)
Ordering Code
133
CY7C0853V-133BBC
CY7C0853V-133BBI
100
CY7C0853V-100BBC
CY7C0853V-100BBI
128K
×
36 (4M) 3.3V Synchronous CY7C0852V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0852V-167BBC
CY7C0852V-167AC
133
CY7C0852V-133BBC
CY7C0852V-133BBI
CY7C0852V-133AC
CY7C0852V-133AI
64K
×
36 (2M) 3.3V Synchronous CY7C0851V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0851V-167BBC
CY7C0851V-167AC
133
CY7C0851V-133BBC
CY7C0851V-133BBI
CY7C0851V-133AC
CY7C0851V-133AI
32K
×
36 (1M) 3.3V Synchronous CY7C0850V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0850V-167BBC
CY7C0850V-167AC
133
CY7C0850V-133BBC
CY7C0850V-133BBI
CY7C0850V-133AC
CY7C0850V-133AI
Package
Name
BB172
BB172
BB172
BB172
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
相關PDF資料
PDF描述
CY7C0850V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
CY7C0850V-133AC FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
CY7C0850V-133AI FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
CY7C0850V-133BBC FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
CY7C0850V-133BBI FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
相關代理商/技術參數
參數描述
CY7C0852V-100BBC 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 3.3V 4.5MBIT 128KX36 5NS 172BGA - Bulk
CY7C0852V-133AC 制造商:Rochester Electronics LLC 功能描述:3.3V 128KX36 SYNC DUAL PORT SRAM - Bulk 制造商:Cypress Semiconductor 功能描述:128K X 36 DUAL-PORT SRAM, 4.4 ns, PQFP176
CY7C0852V-133AXC 功能描述:IC SRAM 4MBIT 133MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2
CY7C0852V-133AXCT 功能描述:IC SRAM 4MBIT 133MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2
CY7C0852V-133AXI 功能描述:IC SRAM 4MBIT 133MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2