- 您現(xiàn)在的位置：買賣IC網 > PDF目錄295174 > BXM80526B500256 (INTEL CORP) 64-BIT, 500 MHz, MICROPROCESSOR, CPGA495 PDF資料下載
參數(shù)資料
| 型號： | BXM80526B500256 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 500 MHz, MICROPROCESSOR, CPGA495 |
| 封裝： | MICRO PGA-495 |
| 文件頁數(shù)： | 47/84頁 |
| 文件大?。?/td> | 450K |
| 代理商： | BXM80526B500256 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁當前第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁
Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet
Intel Corporation
43
5.2
Socketable Micro-PGA2 Package Dimensions
The mobile Pentium III processor is also packaged in a PPGA-B495 package (also known as
Micro-PGA2) with the back of the processor die exposed on top. Unlike previous mobile
processors with exposed die, the back of the mobile Pentium III processor die may be polished and
very smooth. The mechanical specifications for the socketable package are provided in Table 30.
Figure 23 shows the top and side views of the socketable package, and Figure 24 shows the
bottom view of the socketable package. The substrate may only be contacted within the region
between the keep-out outline and the edge of the substrate. The mobile Pentium III processor will
have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region, and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Unlike the BGA2 package, VID implementation does not require
VID pins to be depopulated on the Micro-PGA2 package.
相關PDF資料 |
PDF描述 |
|---|---|
| BXM80526B600256 | 64-BIT, 600 MHz, MICROPROCESSOR, CPGA495 |
| BY8400 | Fast high-voltage soft-recovery rectifiers |
| BY8404 | Fast high-voltage soft-recovery rectifiers |
| BY8406 | Fast high-voltage soft-recovery rectifiers |
| BY8408 | Fast high-voltage soft-recovery rectifiers |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BXM80536NC1400ES L7LS | 制造商:Intel 功能描述:CELERON M,360,1.40GHZ,1M CACHE, 400MHZ FSB,1.26V,UFCPGA - Boxed Product (Development Kits) |
| BXMP1000 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1001 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1002 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1003 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
發(fā)布緊急采購，3分鐘左右您將得到回復。