參數(shù)資料
型號： BX80532KC2600D
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 2600 MHz, MICROPROCESSOR
文件頁數(shù)： 83/129頁
文件大小： 1640K
代理商： BX80532KC2600D
Intel Xeon Processor with 512 KB L2 Cache
Datasheet
57
4.0
Mechanical Specifications
The Intel Xeon processor with 512 KB L2 cache uses Interposer Micro Pin Grid Array (INT-
mPGA) package technology. Components of the package include a flip-chip ball grid array (FC-
BGA) package containing the processor die covered by an integrated heat spreader (IHS) mounted
to a pinned FR4 interposer. Mechanical specifications for the processor are given in this section.
See Section 1.1 for terminology definitions. Figure 26 provides a basic assembly drawing and
includes the components which make up the entire processor. In addition to the package
components, several components are located on the FR4 interposer, including an EEPROM and a
thermal sensor. Package dimensions are provided in Table 28.
The Intel Xeon processor with 512 KB L2 cache utilizes a surface mount 603-pin zero-
insertion force (ZIF) socket for installation into the baseboard. See the 603-Pin Socket Design
Guidelines for further details on the processor socket.
For Figure 28 through Figure 32, the following notes apply:
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. All dimensions are not tested, but are guaranteed by design characterization.
3. Figures and drawings labelled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are Reference Dimensions.
4. Drawings are not to scale.
Note: This drawing is not to scale and is for reference only. The 603-pin socket is supplied as a
reference only.
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM) between processor die and IHS
3. Processor die
4. Flip Chip interconnect
5. FCBGA (Flip Chip Ball Grid Array) package
6. FCBGA solder joints
7. Processor interposer
8. 603-pin socket
9. 603-pin socket solder joints
Figure 26.
INT-mPGA Processor Package Assembly Drawing (Includes Socket)
1
2
9
6
5
4
3
7
8
相關(guān)PDF資料
PDF描述
BU-61582D0-290Z 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BX80532KC2600DU 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.6GHZ - Boxed Product (Development Kits)
BX80532KC2800DU 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.8GHZ - Boxed Product (Development Kits)
BX80532KC2800F 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.8GHZ - Boxed Product (Development Kits)
BX80532KC3000D 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 3GHZ - Boxed Product (Development Kits)
BX80532KC3000H 制造商:Intel 功能描述:MPU XEON NETBURST 64-BIT 0.13UM 3GHZ - Boxed Product (Development Kits)
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