參數(shù)資料
型號： BT168G
廠商： NXP Semiconductors N.V.
元件分類： 參考電壓二極管
英文描述： SCR
封裝： BT168G<SOT54 (SOT54)|<<http://www.nxp.com/packages/SOT54.html<1<week 5, 2005,;
文件頁數(shù)： 5/15頁
文件大?。?/td> 107K
代理商： BT168G
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2.3
2.3
1.6 x 3
4.8
4.2
3.0
2.54
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Fig. 5. Universal SOT223 / SOT428 pad layout.
Fig. 6. SOT428 & SOT223 relative sizes.
SOT428 soldering
This surface mount package features a relatively
large solder area (compared to SOT223) which is
hidden after assembly. Because the mating surfaces
between the main PCB pad and the device are
remote from the outside world, wave soldering
cannot be relied upon to wet the joint sufficiently. It is
therefore necessary to use a reflow soldering method
for packages of this design. Figure 7 shows the
SOT428 solder pad dimensions.
SOT428 design features for surface mountability
It is well known among power semiconductor
manufacturers that the larger a surface mounted
power semiconductors is, the more vulnerable it is to
die stresses during manufacture and during the
surface mounting process. This can result in a
significant percentage of rejects due to die cracking.
We have learned long ago that it is not possible to
use the same manufacturing techniques for surface
mount devices as are used for through-hole devices.
Unacceptable failure rates will certainly be the result,
either during manufacture, during surface mounting
or during prolonged thermal cycling in the
application.
Philips Semiconductors has spent a long time
perfecting its SOT428 package before releasing it
onto the market so that these pitfalls can be avoided.
Described below are some of the special design
features which ensure successful manufacture and
longterm reliable operation in the customer’s
application.
7.0
7.0
2.15
2.5
4.57
1.5
Fig. 7. SOT428 solder pad dimensions.
1. The package is moulded using a low stress
epoxy plastic in order to minimise the bending
force on the mounting base as curing takes place.
Less bending of the mounting base means less
die stress.
2. A thick copper mounting base of 0.89mm (0.035
inches) max thickness is used to further inhibit
any tendency for bending of the mounting base.
3. A low stress, high lead content soft solder is used
for diebonding. The amount of “give” in the solder
accommodates
differential
minimises die stress.
expansions
and
4. A new technique has been developed to
accurately control the thickness and positioning of
the die-attach solder on the diepad. This
guarantees
optimum
complete die area every time without unsoldered
areas or excess solder. The benefit of this is to
offer the best longterm reliability under thermal
stress and the minimum junction-to-mounting
base thermal resistance.
diebonding
over
the
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BT168G,112 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
BT168GW 制造商:NXP Semiconductors 功能描述:THYRISTOR 1A 600V SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:0.63A; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Thyristor,600V,1A,BT168GW
BT168GW,115 功能描述:SCR TAPE-7 TRIAC RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
BT168GWF 制造商:NXP Semiconductors 功能描述:THYRISTOR600VSOT223 制造商:NXP Semiconductors 功能描述:THYRISTOR,600V,SOT223 制造商:NXP Semiconductors 功能描述:THYRISTOR,600V,SOT223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:630mA; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max Ih:10mA; ;RoHS Compliant: Yes
BT168GWF,115 功能描述:SCR 600V 1A SOT223 RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
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