參數(shù)資料
型號(hào)： BT168G
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 參考電壓二極管
英文描述： SCR
封裝： BT168G<SOT54 (SOT54)|<<http://www.nxp.com/packages/SOT54.html<1<week 5, 2005,;
文件頁(yè)數(shù)： 1/15頁(yè)
文件大?。?/td> 107K
代理商： BT168G
APPLICATION NOTE
Surface mounted triacs and thyristors
Introduction
There is an ever growing need in the electronics
industry for miniaturisation and cost reduction of the
end product. In order to satisfy these requirements,
designers are specifying Surface Mount Technology
with increasing regularity. At first their attentions
were aimed at the low power and small signal
components. Now their attentions are turning towards
the power devices in order to give them total surface
mount solutions.
The increased miniaturisation is possible because
surface mounted power semiconductors occupy less
board area than through-hole-mounting devices on
heatsinks. Cost reduction is possible due to the faster
and simpler assembly that result when ALL
components are surface mounted.
The availability of a wide range of package sizes
permits continuous power dissipations ranging from
0.5 Watts to 2 Watts on standard Printed Circuit
Boards. Higher power dissipations are achievable if
special heatsinking provisions are made on the PCB.
Some examples of these include:
A grid of solder vias to a pad on the reverse side
of the PCB.
A PCB-mounted heatsink on one or both sides.
An aluminium-cored PCB.
Fan-assisted cooling.
Surface mount solutions from Philips
Philips Semiconductors has developed a full range of
surface mount power packages for its entire range of
triacs and thyristors. The assembly materials and
technology used are not simply adapted from the
pre-existing
through-hole-mounting
technology; they are unique to SMT.
package
Every new SMT device is subjected to rigorous
testing which originates from stringent automotive
requirements. This consists of full reliability testing
after three surface mounting operations on printed
circuit boards. No failures will be generated. This
gives the best assurance of reliable end products.
This Technical Publication will present the surface
mount
packages
and
performances can be achieved on standard PCBs
without special heatsinking arrangements.
show
what
thermal
SOT223
SOT223 (Fig. 1) is the smallest SMT power package
presented in this publication. The mechanical design
has been optimised for maximum ease & versatility
of surface mounting, and maximum longterm
reliability in the application. It will provide the
minimum cost of ownership to the Original
Equipment Manufacturer when initial purchase costs,
handling costs and final assembly costs are added
together.
The three legs and the heatsink tab emerge
sideways from the edge of the plastic body, where
they are formed to bring them into contact with the
PCB for soldering to the pads. The centre leg and
the larger heatsink tab on the opposite side of the
package are internally connected.
Because the main tab and the three legs emerge
from the edge of the plastic package and are formed
before they make contact with the PCB, a certain
degree of safe movement of the PCB relative to the
device is possible as the assembly expands and
contracts during soldering and during circuit
operation. Since the device’s diepad is not in direct
and intimate contact with the PCB solder pad,
differential
movement
coefficients of expansion can be accommodated
without excessive fatigue stress to the solder joints.
The more extreme condition of stresses being
transmitted to the die, causing it to crack, is also
minimised with this package design.
caused
by
different
SOT223 soldering
When soldering most SMT power packages, a reflow
process must be used. However, for SOT223, it is
also feasible to use wave soldering if required. Wave
soldering is possible because the small size of the
package minimises the size of the “shadow” on the
downstream side of the solder flow. Perhaps more
importantly, the exposed nature of the solder
connections around the periphery of the package,
and their relatively low thermal capacities, mean that
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BT168G,112 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開(kāi)啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
BT168GW 制造商:NXP Semiconductors 功能描述:THYRISTOR 1A 600V SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:0.63A; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Thyristor,600V,1A,BT168GW
BT168GW,115 功能描述:SCR TAPE-7 TRIAC RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開(kāi)啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
BT168GWF 制造商:NXP Semiconductors 功能描述:THYRISTOR600VSOT223 制造商:NXP Semiconductors 功能描述:THYRISTOR,600V,SOT223 制造商:NXP Semiconductors 功能描述:THYRISTOR,600V,SOT223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:630mA; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max Ih:10mA; ;RoHS Compliant: Yes
BT168GWF,115 功能描述:SCR 600V 1A SOT223 RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開(kāi)啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube
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