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參數(shù)資料
| 型號： | BT168E |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SCR |
| 封裝： | BT168E<SOT54 (TO-92)|<<http://www.nxp.com/packages/SOT54.html<1<week 5, 2005,; |
| 文件頁數(shù)： | 8/15頁 |
| 文件大小： | 107K |
| 代理商： | BT168E |
Mounting and soldering
The SM footprint drawings define the solder land
(pad) areas, the solder resist areas and the area
occupied by the package. Since the solder lands
must be completely free of solder resist, the areas
without the solder resist are always slighty greater
than the solder land areas. The solder resist must
cover all areas of the PCB that are not soldered to.
This includes extended areas of copper used for
heatsinking.
The footprints for reflow soldering define the solder
paste areas in addition to the areas listed above.
Solder paste is applied using a metal stencil which
must be accurately aligned to within 0.1mm over the
pads. A metal “squeegee” is drawn across the stencil
to deposit the paste through the apertures, which
must be the same size as the solder paste areas
defined on the footprint drawings. With reference to
Figs. 2 & 3, it can be seen that the optimum pad
areas are different for wave soldering and for reflow
soldering.
When wave soldering, surface mount devices must
be held in position by a small measured dose of
adhesive. A double wave process is used to ensure
better wetting of all joints without solder shadows.
Wave soldering
must
be used if there are any
through-hole components on the PCB.
For reflow soldering, surface mount devices are held
in position by the viscosity of the solder paste. When
the solder is melted in the reflow oven, the surface
tension of the molten solder causes them to self
centre on their pads. For self centreing to operate
reliably, the pad sizes and configuration are critical.
For PCBs which contain a mixture of SM and
through-hole components, both soldering methods
are sometimes employed in order to ensure optimum
soldering of both technologies.
A more detailed description of the wave and reflow
soldering processes is beyond the scope of this
Technical
Publication.
description, please see Data Handbook SC18
entitled SMD Footprint Design and Soldering
Guidelines.
For
a
more
detailed
Thermal resistance - a laboratory investigation.
Detailed laboratory tests have been conducted on
the junction-to-ambient thermal resistance R
th j-a
of
the SOT223, SOT428 and SOT404 SM packages
when mounted to different pad sizes on standard
FR4 PCB. Sufficient time was devoted to this work to
ensure repeatability of the results and to give a high
level of confidence in their validity.
Theory
It is possible to measure the temperature of a power
semiconductor junction by measuring one of its
temperature-dependent characteristics. For example,
for a MOSFET it might be the forward voltage of the
anti-parallel diode and for a thyristor it would be the
forward voltage drop V
T
. In order to heat up the
device under test, a heating current is passed
through it. When measuring its temperature-
dependent characteristic, a much lower calibration
current is passed for a very short measurement
period. For this investigation, thyristors were used
because of the relative ease of their measurement
and because they were freely available in all the
packages of interest.
The size of the die within any given package will not
affect the final R
th j-a
result appreciably because any
differences in the junction-to-case thermal resistance
R
th j-c
will pale into insignificance compared to the
case-to-ambient thermal resistance R
th c-a
. It is not
critical, therefore, which device is used when
measuring package R
th
in free air or when surface
mounted to conventional PCBs with relatively high
thermal resistances to ambient.
FR4 fibreglass pcb with 35
μ
m copper (1oz/square
foot) was used because it is an industry standard to
which everyone can relate. It is the PCB type which
is
always
quoted
in
manufacturers’ data sheets. It has become a
“reference standard” by default. Despite this
“standard” status, many industries cannot justify its
use because of its cost. The home appliance industry
prefers to use a lower cost alternative, one example
of which is CEM3. This is a resin and paper-based
material with fibre on both sides. Fortunately, the
thermal performance of the cheaper alternatives is
sufficiently close to that of FR4 in many cases to
make the results of this investigation valid for those
also.
power
semiconductor
Equipment
The test PCBs had pad sizes which varied upwards
from the minimum recommended for the package.
Consistent pad width / height ratios were maintained.
The pad was always positioned centrally on the test
board to assure consistent heatsinking to the bulk of
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|---|---|
| BT168G | SCR |
| BT150-500R | Thyristor |
| BT150S-600R | Logic level thyristor |
| BT151-1000RT | SCR |
| BT151-500C | SCR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BT168E,112 | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168EW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Thyristors logic level for RCD/ GFI/ LCCB applications |
| BT168G | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168G,112 | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168GW | 制造商:NXP Semiconductors 功能描述:THYRISTOR 1A 600V SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:0.63A; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Thyristor,600V,1A,BT168GW |
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