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參數(shù)資料
| 型號(hào)： | BT168E |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SCR |
| 封裝： | BT168E<SOT54 (TO-92)|<<http://www.nxp.com/packages/SOT54.html<1<week 5, 2005,; |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 107K |
| 代理商： | BT168E |
5. Special locking features are used to lock the
epoxy to the metal to improve hermeticity. These
features have been carefully optimised to provide
good hermeticity without locking the epoxy too
rigidly to the diepad, which can result in excess
die stress during differential expansion.
6. A bare copper diepad is used for best adhesion of
the epoxy to the metal. This promotes good
hermeticity.
7. All mating surfaces to be soldered to the PCB
pads are tin-lead solder plated for good
solderability.
8. The footprint is compatible with JEDEC and
Motorola layouts.
9. The coplanarity of leads to seating plane and
leads to leads meets stringent industry standards.
10. A fully automatic high volume production line is
used which takes in the raw components at its
input and delivers assembled, 100% tested,
packaged devices at its output.
11. All assembled devices are subjected to an in-line
surface mount temperature profile pass to
eliminate any remaining possibility, however
small, of zero hour defects at the customer.
12.
Devices are packaged in industry standard blister
pack reels for loading onto automatic pick-and-
place machines.
SOT404
SOT404 (Fig. 9, also known as TO263 and D
2
PAK)
possesses the same size of plastic body as SOT78
(TO220). The similarity ends there. SOT404 is
manufactured without a tab since no mounting hole
is required. (It is not merely a cropped TO220!) The
centre lead is cropped close to the plastic, so the
“centre leg connection” is made via the metal
backplate. The two outer leads are formed
downwards to bring them into contact with the PCB.
SOT404 soldering
As for SOT428, it is also not possible to solder
SOT404 using a wave soldering technique. The even
larger body and larger hidden solder area would put
this method out of the question. Reflow soldering is
essential. Figure 8 shows the SOT404 solder pad
dimensions.
SOT404 design features for surface mountability
In designing and manufacturing the SOT404
package, similar measures must be taken as for
SOT428 to ensure a reliable end product. These
include:
17.5
11.5
9.0
5.08
3.8
2.0
Fig. 8. SOT404 solder pad dimensions.
1. A low stress epoxy to minimise bending forces on
the mounting base after curing. (Minimises die
stress.)
2. A thick copper mounting base of 1.4mm (0.055
inches) max thickness to further minimise any
tendency to bend.
3. A low stress, high lead content soft diebond
solder. (Minimises die stress.)
4. Accurate dosing and spreading of the die-attach
solder prior to diebonding to ensure optimum
diebonding over the complete die area every time
without unsoldered areas or excess solder. This
offers best longterm reliability under thermal
cycling and optimum junction-to-mounting base
thermal resistance.
5. Optimised locking features to balance the
conflicting requirements of good hermeticity with
sufficient differential movement to avoid die
stress fracture.
6. A bare copper comb to ensure good epoxy-to-
metal adhesion for best hermeticity.
7. Tin-lead solder plating of all exposed copper,
including all cropped edges, for optimum
solderability.
8. Compatibility with the industry standard footprint
layout for D
2
PAK.
9. Coplanarity check on leads to seating plane and
leads to leads.
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| BT151-1000RT | SCR |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BT168E,112 | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168EW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Thyristors logic level for RCD/ GFI/ LCCB applications |
| BT168G | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168G,112 | 功能描述:SCR BULK MOSFET RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT168GW | 制造商:NXP Semiconductors 功能描述:THYRISTOR 1A 600V SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223 制造商:NXP Semiconductors 功能描述:THYRISTOR, 1A, 600V, SOT-223; Peak Repetitive Off-State Voltage, Vdrm:600V; Gate Trigger Current Max, Igt:200A; Current It av:0.63A; On State RMS Current IT(rms):1A; Peak Non Rep Surge Current Itsm 50Hz:8A; Holding Current Max ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Thyristor,600V,1A,BT168GW |
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