參數(shù)資料
型號： BC184LB
英文描述： IC FLEX 10KA FPGA 100K 240-RQFP
中文描述： 晶體管|晶體管|叩| 30V的五（巴西）總裁| 500mA的一（c）|至92
文件頁數(shù)： 3/4頁
文件大?。?/td> 68K
代理商： BC184LB
BC184L, BC184LB
BC184LC
TO-92
Plastic Package
TO-92 Transistors on Tape and Ammo Pack
TO-92 Plastic Package
PIN CONFIGURATION
1. BASE
2. COLLECTOR
3. EMITTER
B
A
L
S
D
U
B
K
E
D
A A
SEC AA
G
D
3
21
1
2
3
F
F
H
C
3 2 1
All dimnsions in mm
DIM
MIN.
MAX.
A
B
C
D
E
F
G
H
K
L
4.32
4.45
3.18
0.41
0.35
5.33
5.20
4.19
0.55
0.50
5 DEG
1.14
1.14
12.70
1.982
1.40
1.53
—
2.082
CUMULATIVE PITCH
ERROR 1.0 mm/20
PITCH
TO BE MEASURED AT
BOTTOM OF CLINCH
AT TOP OF BODY
t1 0.3 - 0.6
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
COMPONENT ALIGNMENT
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCEF1,
CLINCH HEIGHT
PULL - OUT FORCE
ITEM
A1
A
T
P
Po
P2
F
h
W
Wo
W1
W2
Ho
H1
L
Do
t
F2
H2
(P)
SYMBOL
SPECIFICATION
MIN.
NOM.
4.0
4.8
3.9
6N
12.7
12.7
6.35
5.08
0
18
6
9
0.5
16
4
2.54
4.8
5.2
4.2
1
23.25
11.0
1.2
3
MAX.
±1
±0.3
±0.4
+0.6
-0.2
±0.5
±0.2
+0.7
-0.5
±0.2
±0.5
±0.2
+0.4
-0.1
TOL .
REMARKS
NOTES
1. MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2 mm.
2. MAXIMUM NON-CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1 mm IN 20
PITCHES.
3. HOLDDOWN TAPE NOT TO EXCEED BEYOND THE EDGE(S) OF CARRIER TAPE AND THERE SHALL BE NO
EXPOSURE OF ADHESIVE.
4. NO MORE THAN 3 CONSECUTIVE MISSING COMPONENTS ARE PERMITTED.
5. A TAPE TRAILER, HAVING AT LEAST THREE FEED HOLES ARE REQUIRED AFTER THE LAST COMPONENT.
6. SPLICES SHALL NOT INTERFERE WITH THE SPROCKET FEED HOLES.
All dimensions in mm unless specified otherwise
Ammo Pack Style
Adhesive Tape on Top Side
FLAT SIDE
MECHANICAL DATA
T
t1
t
F1
F2
F
P2
Po
Do
(p)
W2
Wo
W1
W
H1
A
A1
P
H0
L
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Ammo Pack
LABEL
Carrier
Strip
183
mm
FEED
m42
h
h
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5K
2K
17" x 15" x 13.5"
17" x 15" x 13.5"
80K
32K
23 kgs
12.5 kgs
PACKAGE
Net Weight/Qty
Details
STANDARD PACK
INNER CARTON BOX
Qty
OUTER CARTON BOX
Qty
Gr Wt
Size
Size
Packing Detail
Continental Device India Limited
Data Sheet
Page 3 of 4
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相關代理商/技術參數(shù)
參數(shù)描述
BC184LBV 制造商: 功能描述:184LBV
BC184LC 功能描述:兩極晶體管 - BJT NPN 45V 200mA HFE/9 RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
BC184LC_D27Z 功能描述:兩極晶體管 - BJT NPN 45V 200mA HFE/900 RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
BC184LC_J35Z 功能描述:兩極晶體管 - BJT W/CNTR COLLECTOR PINOUT RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
BC184LC_L34Z 功能描述:兩極晶體管 - BJT Si NPN Transistor Small Signal RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
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