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參數(shù)資料
| 型號： | AS1533-T |
| 廠商： | AUSTRIAMICROSYSTEMS AG |
| 元件分類： | ADC |
| 英文描述： | 12-Bit, 4-CH, ADC, 300ksps; Package Type: TSSOP-16 |
| 封裝： | TSSOP-16 |
| 文件頁數(shù)： | 26/28頁 |
| 文件大小： | 920K |
| 代理商： | AS1533-T |
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www.austriamicrosystems.com
Revision 1.00
26 - 28
AS1532/AS1533
Data Sheet
- Package Drawings and Markings
10 Package Drawings and Markings
Figure 36. 16-pin TSSOP Package
Symbol
A
A1
A2
L
R
R1
b
b1
c
c1
θ
1
L1
aaa
bbb
ccc
ddd
e
θ
2
θ
3
Min
-
0.05
0.85
0.50
0.09
0.09
0.19
0.19
0.09
0.09
0o
Typ
-
-
0.90
0.60
-
-
-
0.22
-
-
-
1.0REF
0.10
0.10
0.05
0.20
0.65BSC
12oREF
12oREF
Variations
5.00
4.40
6.4BSC
0.65BSC
16
Max
1.10
0.15
0.95
0.75
-
-
0.30
0.25
0.20
0.16
8o
Notes
1,2
1,2
1,2
1,2
1,2
1,2
1,2,5
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
D
E1
E
e
N
4.90
4.30
5.10
4.50
1,2,3,8
1,2,4,8
1,2
1,2
1,2,6
Notes:
1. All dimensions are in millimeters; angles in degrees.
2. Dimensioning and tolerancing per
ASME Y14.5M – 1994
.
3. Dimension D does not include mold flash, protrusions, or gate
burrs. Mold flash, protrusions, and gate burrs shall not exceed
0.15mm per side.
4. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusions shall not exceed 0.25mm per
side.
5. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot.
6. Terminal numbers are for reference only.
7. Datums A and B to be determined at datum plane H.
8. Dimensions D and E1 are to be determined at datum plane H.
9. This dimension applies only to variations with an even number
of leads per side.
10. Cross section A-A to be determined at 0.10 to 0.25mm from
the leadtip.
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相關代理商/技術參數(shù) |
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|---|---|
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