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參數(shù)資料
| 型號(hào)： | APA300-FGG144I |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 157/178頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FPGA PROASIC+ 300K 144-FBGA |
| 標(biāo)準(zhǔn)包裝： | 160 |
| 系列： | ProASICPLUS |
| RAM 位總計(jì)： | 73728 |
| 輸入/輸出數(shù)： | 100 |
| 門(mén)數(shù)： | 300000 |
| 電源電壓： | 2.3 V ~ 2.7 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 144-LBGA |
| 供應(yīng)商設(shè)備封裝： | 144-FPBGA（13x13） |
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ProASICPLUS Flash Family FPGAs
1- 4
v5.9
Data Sheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet
Supplement." The definition of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general product
information. This brief gives an overview of specific device and family information.
Advance
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the general family
datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and
for specifications that do not differ between the two families.
Export Administration Regulations (EAR)
The products described in this datasheet are subject to the Export Administration Regulations (EAR). They could
require an approved export license prior to export from the United States. An export includes release of product or
disclosure of technology to a foreign national inside or outside the United States.
Actel Safety Critical, Life Support, and High-Reliability Applications
Policy
The Actel products described in this advance status datasheet may not have completed Actel’s qualification process.
Actel may amend or enhance products during the product introduction and qualification process, resulting in changes
in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any Actel
product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-
support, and other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability exclusions
relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel
website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and
lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| APA300-FG144I | IC FPGA PROASIC+ 300K 144-FBGA |
| AGL600V5-FG144I | IC FPGA 1KB FLASH 600K 144-FBGA |
| ACM40DTAH-S189 | CONN EDGECARD 80POS R/A .156 SLD |
| ACM40DTAD-S189 | CONN EDGECARD 80POS R/A .156 SLD |
| M1AGL600V5-FGG144I | IC FPGA 1KB FLASH 600K 144-FBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| APA300-FGG144M | 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 300K GATES 180MHZ 0.22UM 2.5V 144FBGA - Trays |
| APA300-FGG256 | 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASICPLUS 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門(mén)數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| APA300-FGG256A | 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASICPLUS 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| APA300-FGG256I | 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASICPLUS 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門(mén)數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| APA300-FGG256M | 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 300K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays |
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