參數(shù)資料
型號: APA2068KAI-TUL
廠商: Anpec Electronics Corporation
英文描述: Stereo 2.6W Audio Power Amplifier (with DC_Volume Control)
中文描述: 立體聲2.6W音頻功率放大器(帶DC_Volume控制)
文件頁數(shù): 23/27頁
文件大?。?/td> 495K
代理商: APA2068KAI-TUL
Copyright
ANPEC Electronics Corp.
Rev. A.2 - Jul., 2005
APA2068
www.anpec.com.tw
23
Application Descriptions ( Cont.)
design issues are not properly addressed, the
APA2068 4
will go into thermal shutdown when
driving a 4
load.
The thermal pad on the bottom of the APA2068 should
be soldered down to a copper pad on the circuit board.
Heat can be conducted away from the thermal pad
through the copper plane to ambient. If the copper plane
is not on the top surface of the circuit board, 8 to 10
vias of 13 mil or smaller in diameter should be used to
thermally couple the thermal pad to the bottom plane.
For good thermal conduction, the vias must be plated
through and solder filled. The copper plane used to
conduct heat away from the thermal pad should be as
large as practical.
If the ambient temperature is higher than 25°C, a larger
copper plane or forced-air cooling will be required to
keep the APA2068 junction temperature below the
thermal shutdown temperature (150°C). In higher
ambient temperature, higher airflow rate and/or larger
copper area will be required to keep the IC out of
thermal shutdown.
Thermal Considerations
Linear power amplifiers dissipate a significant amount
of heat in the package under normal operating
conditions.
To calculate maximum ambient temperatures, first
consideration is that the numbers from the
Power
Dissipation vs. Output Power
graphs are per
channel values, so the dissipation of the IC heat needs
to be doubled for two-channel operation. Given
θ
JA
, the
maximum allowable junction temperature (T
JMAX
), and
the total internal dissipation (P
D
), the maximum
ambient temperature can be calculated with the
following equation. The maximum recommended
junction temperature for the APA2068 is 150°C. The
Thermal Pad Considerations (Cont.)
internal dissipation figures are taken from the
Power
Dissipation vs. Output Power
graphs.
T
AMax
= T
JMax
-
θ
JA
P
D
(16)
150 - 45(0.8*2) = 78°C
The APA2068 is designed with a thermal shutdown
protection that turns the device off when the junction
temperature surpasses 150°C to prevent damaging the
IC.
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