
AO4600
Symbol
STATIC PARAMETERS
Drain-Source Breakdown Voltage
Min
Typ
Max
Units
BV
DSS
30
V
1
5
T
J
=55°C
I
GSS
V
GS(th)
I
D(ON)
100
1.4
nA
V
A
0.7
25
1
22.6
33
27
42
27
40
32
50
T
J
=125°C
m
m
g
FS
V
SD
I
S
DYNAMIC PARAMETERS
Input Capacitance
Output Capacitance
12
16
0.71
S
V
A
1
3
C
iss
C
oss
C
rss
R
g
SWITCHING PARAMETERS
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
858
110
80
1.24
1050
pF
pF
pF
4
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
9.6
1.65
3
5.7
13
37
4.2
15.5
7.9
12
nC
nC
nC
ns
ns
ns
ns
ns
nC
Body Diode Reverse Recovery time
Body Diode Reverse Recovery charge
20
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL 
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS.  AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Turn-Off Fall Time
V
GS
=4.5V, V
DS
=15V, I
D
=6.9A
V
GS
=10V, V
DS
=15V, R
L
=2.2
, 
R
GEN
=6
Reverse Transfer Capacitance
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode Continuous Current
V
DS
=5V, I
D
=5A
I
S
=1A
V
GS
=0V, V
DS
=15V, f=1MHz
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=6.9A  
m
V
GS
=4.5V, I
D
=6.0A  
V
GS
=2.5V, I
D
=5A  
Gate Threshold Voltage
On state drain current
V
DS
=V
GS  
I
D
=250
μ
A
V
GS
=4.5V, V
DS
=5V
V
DS
=24V, V
GS
=0V  
μ
A
Gate-Body leakage current
V
DS
=0V, V
GS
=±12V
I
F
=5A, dI/dt=100A/
μ
s
I
F
=5A, dI/dt=100A/
μ
s
n-channel MOSFET Electrical Characteristics (T
J
=25°C unless otherwise noted)
Parameter
Conditions
I
D
=250
μ
A, V
GS
=0V  
I
DSS
Zero Gate Voltage Drain Current
A: The value of R
θ
JA
 is measured with the device mounted on 1in
 2
 FR-4 board with 2oz. Copper, in a still air environment with T
 A
=25°C. The value in 
any given application depends on the user's specific board design. The current rating is based on the t   
≤
 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R
θ
JA
 is the sum of the thermal impedence from junction to lead R
θ
JL
 and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 
μ
s pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
provides a single pulse rating. 
Rev 4 : Sept 2005
  2
 FR-4 board with 2oz. Copper, in a still air environment with T
 A
=25°C. The SOA curve 
Alpha & Omega Semiconductor, Ltd.