參數(shù)資料
型號: AND8009
廠商: ON SEMICONDUCTOR
英文描述: ECLinPS Plus SPICE Modeling Kit
中文描述: 業(yè)界的EClinPS加SPICE建模套件
文件頁數(shù): 65/67頁
文件大小: 211K
代理商: AND8009
AND8009/D
http://onsemi.com
65
APPENDIX A
Package Models Help
In the SPICE netlist, X_777 is a circuit element (black
box) with connections to a subcircuit:
circuit element connections subcircuit
X_777 N01I N01O N021 N02O N03I N03O N04I N04O
+N05I N05O N061 N06O N07I N07O N08I N08O GND PACKAGE
The defined connection nodes of the circuit element are
declared as:
N01I N01O N021 N02O N03I N03O N04I N04O
N05I N05O N061 N06O N07I N07O N08I N08O GND
The subcircuit PACKAGE is connected to these same nodes:
.SUBCKT PACKAGE N01I N01O N021 N02O N03I N03O N04I N04O
+N05I N05O N061 N06O N07I N07O N08I N08O GND
where:
N01I is the PACKAGE pin #1 internal node connection to the chip pad
N01O is the PACKAGE pin #1 external node connecting to the lead
Internal to the subcircuit PACKAGE are several nodes for
each pin (See Figure 7). For pin 2, of the 8 pin TSSOP, the
netlist:
R02WB N02I N02W 3.815e02
L02WB N02W N02R 9.835e10
R02 N02R N02C 9.680e04
C02 N02C GND 7.711e14
L02 N02C N02O 7.466e10
Figure 21.
GND
C02
R02
N02I
N02O
N02C
N02R
L02
L02WB
R02WB
N02W
Parasitic Mutual inductance, K, and capacitance, C, is also
represented. Such as “K0102”, where inductance from Lead
#1 (L01) to Lead #2 (L02) is indicated.
K0102 L01 L02 0.2481
K0102WB L01WB L02WB 0.1729
C0102 N01C N02C 2.283e14
K0103 L01 L03 0.1067
K0103WB L01WB L03WB 0.0598
K0104 L01 L04 0.0593
K0203 L02 L03 0.2479
K0203WB L02WB L03WB 0.1463
C0203 N02C N03C 2.136e14
K0204 L02 L04 0.1068
K0204WB L02WB L04WB 0.0598
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