參數(shù)資料
型號(hào): AM50DL128CG85IS
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲(chǔ)器
英文描述: 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA88
封裝: 11.60 X 8 MM, FBGA-88
文件頁(yè)數(shù): 61/63頁(yè)
文件大?。?/td> 464K
代理商: AM50DL128CG85IS
60
Am50DL128CG
November 7, 2002
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
FTA088—88-Ball Fine-Pitch Grid Array 11.6 x 8 mm
3237 \ 16-038.14b
PACKAGE
FTA 088
JEDEC
N/A
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.25
---
---
BALL HEIGHT
A2
1.00
---
1.11
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
88
BALL COUNT
0.30
0.35
0.40
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3,A4,A5,A6,A7,A8,B1,B10,C1,C10,D1,D10
DEPOPULATED SOLDER BALLS
E1,E10,F1,F10,G1,G10,H1,H10
J1,J10,K1,K10,L1,L10,M3,M4,M5,M6,M7,M8
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10
INDEX MARK
L
M
88X
eD
CORNER
C
0.15
(2X)
(2X)
C
0.15
E1
7
SE
B
A
D1
A
B
D
C
E
F
H
G
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
6
b
0.20
C
C
0.15
0.08
M
M
C
C
A B
PIN A1
7
D
E
PIN A1
CORNER
C
TOP VIEW
SIDE VIEW
A2
A1
A
0.08
相關(guān)PDF資料
PDF描述
AM50DL128CG85IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DLI28BG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am50DL128BG70I Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am50DL128BG85I Circular Connector; No. of Contacts:128; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
AM5380 SCSI Interface Controller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM50DL128CG85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CH 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am50DL128CH - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CH_04 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128CH56IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128CH56IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM