參數(shù)資料
型號(hào): AM29DL324GT12WMIN
廠商: SPANSION LLC
元件分類: PROM
英文描述: 2M X 16 FLASH 3V PROM, 120 ns, PBGA48
封裝: 6 X 12 MM, 0.80 MM PITCH, FBGA-48
文件頁(yè)數(shù): 58/59頁(yè)
文件大?。?/td> 1404K
代理商: AM29DL324GT12WMIN
6
Am29DL32xG
September 27, 2004
DAT AS HEE T
CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (TSOP, BGA, PLCC, SSOP).
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150
°C for prolonged periods of time.
A1
B1
C1
D1
E1
F1
G1
H1
A2
B2
C2
D2
E2
F2
G2
H2
A3
B3
C3
D3
E3
F3
G3
H3
A4
B4
C4
D4
E4
F4
G4
H4
A5
B5
C5
D5
E5
F5
G5
H5
A6
B6
C6
D6
E6
F6
G6
H6
DQ15/A-1
VSS
BYTE#
A16
A15
A14
A12
A13
DQ13
DQ6
DQ14
DQ7
A11
A10
A8
A9
VCC
DQ4
DQ12
DQ5
A19
NC
RESET#
WE#
DQ11
DQ3
DQ10
DQ2
A20
A18
WP#/ACC
RY/BY#
DQ9
DQ1
DQ8
DQ0
A5
A6
A17
A7
OE#
VSS
CE#
A0
A1
A2
A4
A3
48-Ball Fine-pitch BGA (6 x 12 mm)
Top View, Balls Facing Down
B3
C3
D3
E3
F3
G3
H3
B4
C4
D4
E4
F4
G4
H4
B5
C5
D5
E5
F5
G5
H5
B6
C6
D6
E6
F6
G6
H6
B7
C7
D7
E7
F7
G7
H7
B8
C8
D8
E8
F8
G8
H8
RFU
VSS
VCCQ
RFU
VSS
DQ15
BYTE#
A16
A15
A14
A12
DQ6
DQ13
DQ14
DQ7
A11
A10
A8
DQ4
VCC
DQ12
DQ5
A19
A21
RESET#
DQ3
DQ11
DQ10
DQ2
A20
A18
WP#/ACC
DQ1
DQ9
DQ8
DQ0
A5
A6
A17
A3
A4
A5
A6
A7
A8
RFU
A13
A9
WE#
RY/BY#
A7
B2
C2
D2
E2
F2
G2
H2
VSS
OE#
CE#
A0
A1
A2
A4
A2
A3
B1
C1
D1
E1
F1
G1
H1
RFU
VCCQ
RFU
A1
RFU
64-Ball Fortified BGA (11 x 13 mm)
Top View, Balls Facing Down
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