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  • 參數(shù)資料
    型號(hào): AM29DL324GT12WMIN
    廠商: SPANSION LLC
    元件分類: PROM
    英文描述: 2M X 16 FLASH 3V PROM, 120 ns, PBGA48
    封裝: 6 X 12 MM, 0.80 MM PITCH, FBGA-48
    文件頁(yè)數(shù): 23/59頁(yè)
    文件大小: 1404K
    代理商: AM29DL324GT12WMIN
    This document contains information on a product under development at Advanced Micro Devices. The information
    is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
    product without notice.
    Publication# 25686
    Rev: B Amendment/7
    Issue Date: September 27, 2004
    Refer to AMD’s Website (www.amd.com) for the latest information.
    Am29DL32xG
    32 Megabit (4 M x 8-Bit/2 M x 16-Bit)
    CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory
    DISTINCTIVE CHARACTERISTICS
    ARCHITECTURAL ADVANTAGES
    ■ Simultaneous Read/Write operations
    — Data can be continuously read from one bank while
    executing erase/program functions in other bank
    — Zero latency between read and write operations
    ■ Multiple bank architectures
    — Three devices available with different bank sizes
    (refer to Table 3)
    ■ 256-byte SecSi (Secured Silicon) Sector
    — Factory locked and identifiable: 16 bytes available for
    secure, random factory Electronic Serial Number;
    verifiable as factory locked through autoselect
    function. ExpressFlash option allows entire sector to
    be available for factory-secured data
    — Customer lockable: One time programmable. Once
    locked, data cannot be changed.
    ■ Zero Power Operation
    — Sophisticated power management circuits reduce
    power consumed during inactive periods to nearly
    zero
    ■ Package options
    — 63-ball FBGA
    — 48-ball FBGA
    — 48-pin TSOP
    — 64-ball Fortified BGA
    ■ Top or bottom boot block
    ■ Manufactured on 0.17 m process technology
    ■ Compatible with JEDEC standards
    — Pinout and software compatible with
    single-power-supply flash standard
    PERFORMANCE CHARACTERISTICS
    ■ High performance
    — Access time as fast 70 ns
    — Program time: 4 s/word typical utilizing Accelerate
    function
    ■ Ultra low power consumption (typical values)
    — 2 mA active read current at 1 MHz
    — 10 mA active read current at 5 MHz
    — 200 nA in standby or automatic sleep mode
    ■ Minimum 1 million erase cycles guaranteed per
    sector
    ■ 20 year data retention at 125°C
    — Reliable operation for the life of the system
    SOFTWARE FEATURES
    ■ Data Management Software (DMS)
    — AMD-supplied software manages data programming,
    enabling EEPROM emulation
    — Eases historical sector erase flash limitations
    ■ Supports Common Flash Memory Interface (CFI)
    ■ Erase Suspend/Erase Resume
    — Suspends erase operations to allow programming in
    same bank
    ■ Data# Polling and Toggle Bits
    — Provides a software method of detecting the status of
    program or erase cycles
    ■ Unlock Bypass Program command
    — Reduces overall programming time when issuing
    multiple program command sequences
    HARDWARE FEATURES
    ■ Any combination of sectors can be erased
    ■ Ready/Busy# output (RY/BY#)
    — Hardware method for detecting program or erase
    cycle completion
    ■ Hardware reset pin (RESET#)
    — Hardware method of resetting the internal state
    machine to the read mode
    ■ WP#/ACC input pin
    — Write protect (WP#) function allows protection of two
    outermost boot sectors, regardless of sector protect
    status
    — Acceleration (ACC) function accelerates program
    timing
    ■ Sector protection
    — Hardware method of locking a sector, either
    in-system or using programming equipment, to
    prevent any program or erase operation within that
    sector
    — Temporary Sector Unprotect allows changing data in
    protected sectors in-system
    For new designs involving TSOP packages, S29JL032H supersedes Am29DL32xG and is the factory recom-
    mended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information.
    For new designs involving Fine-pitch BGA (FBGA) packages, S29PL032J supersedes Am29DL32xG and is the
    factory-recommended migration path. Please refer to the S29PL032J Datasheet for specifications and ordering
    information.
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