DC and Power Characteristics
3-20
Revision 4
Table 3-13 Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1
CLOAD (pF)
VCCI (V)
Static Power
PDC8 (mW)2
Dynamic Power
PAC10 (W/MHz)3
Applicable to Pro I/O Banks
Single-Ended
3.3 V LVTTL/LVCMOS
35
3.3
–
474.70
2.5 V LVCMOS
35
2.5
–
270.73
1.8 V LVCMOS
35
1.8
–
151.78
1.5 V LVCMOS (JESD8-11)
35
1.5
–
104.55
3.3 V PCI
10
3.3
–
204.61
3.3 V PCI-X
10
3.3
–
204.61
Voltage-Referenced
3.3 V GTL
10
3.3
–
24.08
2.5 V GTL
10
2.5
–
13.52
3.3 V GTL+
10
3.3
–
24.10
2.5 V GTL+
10
2.5
–
13.54
HSTL (I)
20
1.5
7.08
HSTL (II)
20
1.5
13.88
27.22
SSTL2 (I)
30
2.5
16.69
105.56
SSTL2 (II)
30
2.5
25.91
116.60
SSTL3 (I)
30
3.3
26.02
114.87
SSTL3 (II)
30
3.3
42.21
131.76
Differential
LVDS
–
2.5
7.70
89.62
LVPECL
–
3.3
19.42
168.02
Applicable to Advanced I/O Banks
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
–
468.67
2.5 V LVCMOS
35
2.5
–
267.48
1.8 V LVCMOS
35
1.8
–
149.46
1.5 V LVCMOS (JESD8-11)
35
1.5
–
103.12
3.3 V PCI
10
3.3
–
201.02
3.3 V PCI-X
10
3.3
–
201.02
Notes:
1. Dynamic power consumption is given for standard load and software-default drive strength and output slew.
2. PDC8 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.