參數(shù)資料
型號: ADV473KP80
廠商: ANALOG DEVICES INC
元件分類: 顯示控制器
英文描述: Circular Connector; No. of Contacts:55; Series:LJTP02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:17; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:17-55
中文描述: PALETTE-DAC DSPL CTLR, PQCC68
封裝: PLASTIC, LCC-68
文件頁數(shù): 12/12頁
文件大?。?/td> 200K
代理商: ADV473KP80
ADV473
–12–
REV. A
C
P
Analog Signal Interconnect
T he ADV473 should be located as close as possible to the out-
put connectors to minimize noise pickup and reflections due to
impedance mismatch.
T he video output signals should overlay the ground plane, and
not the analog power plane, to maximize the high frequency
power supply rejection.
For maximum performance, the analog outputs should each
have a 75
load resistor connected to GND. T he connection
between the current output and GND should be as close as pos-
sible to the ADV473 to minimize reflections.
For more information on circuit board design and layout, see
application note entitled “Design and Layout of a Video Graph-
ics System for Reduced EMI” available from Analog Devices,
Publication No. E1309-15-10/89.
COMPONENT
DESCRIPTION
0.1
μ
F CERAMIC CAPACITOR
10
μ
F TANTALUM CAPACITOR
FERRITE BEAD
75
1% METAL FILM RESISTOR
1% METAL FILM RESISTOR
VENDOR PART NUMBER
C1 – C5
C6
L1
R1, R2, R3
R
SET
ERIE RPE112Z5U104M50V
MALLORY CSR13G106KM
FAIR-RITE 2743001111
0.1
μ
F
ANALOG POWER PLANE
IOR
IOG
IOB
V
AA
ADV473
V
REFIN
75
75
V
REFOUT
CO-AXIAL CABLE
(75
)
GND
BNC
CONNECTORS
75
75
75
MONITOR
(CRT)
0.1
μ
F
10
μ
F
POWER SUPPLY DECOUPLING
(0.1
μ
F CAPACITOR FOR
EACH V
REF
GROUP)
0.1
μ
F
L1
(FERRITE
BEAD)
COMP
COMP
+5V (V
AA
)
0.1
μ
F
+5V (V
AA
)
+5V (V
CC
)
R
SET
140
R
SET
0.1
μ
F
75
Figure 8. Typical Connection Diagram (Internal Voltage
Reference)
Package T hermal Considerations
In certain circumstances, the 135 MHz version of the ADV473
may require forced air cooling or the addition of a heatsink. T he
68-pin PLCC has a heat resistance characteristic as shown in
T able VIII.
It should be noted that information on Package Thermal Characteris-
tics published herein may not be the most up to date at the time of
reading this. Advances in packaging technology will inevitably lead
to improvements in thermal data. Please contact your local sales office
for the most up-to-date information.
T able VIII. T hermal Resistance vs. Airflow
Air Velocity
(Linear Feet/Min)
0 (Still Air)
50
100
200
θ
JA
(
°
C/W)
32
26
19
16
OUT LINE DIME NSIONS
Dimensions shown in inches and (mm).
Plastic Leaded Chip Carrier
(P-68A)
0.954 (24.23)
0.995 (25.27)
61
10
44
9
43
26
60
TOP VIEW
PIN 1
IDENTIFIER
27
0.029 (0.74)
0.027 (0.69)
0.019 (0.48)
0.017 (0.43)
0.175 (4.45)
0.169 (4.29)
0.925 (23.50)
0.895 (22.73)
0.104 (2.64) TYP
0.050
(1.27)
TYP
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