參數(shù)資料
型號： AD9649BCPZRL7-80
廠商： Analog Devices Inc
文件頁數(shù)： 32/32頁
文件大?。?/td> 0K
描述： IC ADC 14BIT 80MSPS 32LFCSP
標準包裝： 1,500
位數(shù)： 14
采樣率（每秒）： 80M
數(shù)據(jù)接口： 串行，SPI?
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 100mW
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 32-LFCSP-VQ
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 2 個單端，單極；1 個差分，單極
AD9649
Rev. 0 | Page 9 of
32
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND1
0.3 V to +2.0 V
DRVDD to AGND1
0.3 V to +3.9 V
VIN+, VIN to AGND1
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND1
0.3 V to AVDD + 0.2 V
VREF to AGND1
0.3 V to AVDD + 0.2 V
SENSE to AGND1
0.3 V to AVDD + 0.2 V
VCM to AGND1
0.3 V to AVDD + 0.2 V
RBIAS to AGND1
0.3 V to AVDD + 0.2 V
CSB to AGND1
0.3 V to DRVDD + 0.3 V
SCLK/DFS to AGND1
0.3 V to DRVDD + 0.3 V
SDIO/PDWN to AGND1
0.3 V to DRVDD + 0.3 V
MODE/OR to AGND1
0.3 V to DRVDD + 0.3 V
D0 through D13 to AGND1
0.3 V to DRVDD + 0.3 V
DCO to AGND1
0.3 V to DRVDD + 0.3 V
Operating Temperature Range (Ambient)
40°C to +85°C
Maximum Junction Temperature Under Bias
150°C
Storage Temperature Range (Ambient)
65°C to +150°C
1 AGND refers to the analog ground of the customer’s PCB.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle is the only ground connection for the chip
and must be soldered to the analog ground plane of the user’s
PCB. Soldering the exposed paddle to the user’s board also
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
Airflow
Velocity
(m/sec)
θJB1, 4
Ψ
Unit
32-Lead LFCSP
5 mm × 5 mm
0
37.1
3.1
20.7
0.3
°C/W
1.0
32.4
0.5
°C/W
2.5
29.1
0.8
°C/W
1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION
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