參數(shù)資料
型號： AD9517-4ABCPZ-RL7
廠商： Analog Devices Inc
文件頁數(shù)： 51/80頁
文件大?。?/td> 0K
描述： IC CLOCK GEN 1.8GHZ VCO 48LFCSP
設(shè)計資源： High Performance, Dual Channel IF Sampling Receiver (CN0140)
標(biāo)準(zhǔn)包裝： 750
類型： 時鐘發(fā)生器，扇出配送
PLL： 是
輸入： CMOS，LVDS，LVPECL
輸出： CMOS，LVDS，LVPECL
電路數(shù)： 1
比率 - 輸入:輸出： 1:12
差分 - 輸入:輸出： 是/是
頻率 - 最大： 1.8GHz
除法器/乘法器： 是/無
電源電壓： 3.135 V ~ 3.465 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 48-LFCSP-VQ（7x7）
包裝： 帶卷 (TR)
Data Sheet
AD9517-4
Rev. E | Page 55 of 80
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 48-Lead LFCSP
Symbol
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Value (°C/W)
θJA
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
24.7
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
21.6
θJMA
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
19.4
θJB
Junction-to-board thermal resistance, natural convection per JEDEC JESD51-8 (still air)
12.9
ΨJB
Junction-to-board characterization parameter, natural convection per JEDEC JESD51-6 (still air)
and JEDEC JESD51-8
11.9
ΨJB
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
11.8
ΨJB
Junction-to-board characterization parameter, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
11.6
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
1.3
ΨJT
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
0.1
ΨJT
Junction-to-top-of-package characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-2 (still air)
0.2
ΨJT
Junction-to-top-of-package characterization parameter, 2.0 m/sec airflow per JEDEC JESD51-2 (still air)
0.3
Use the following equation to determine the junction
temperature of the AD9517 on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 51.
PD is the power dissipation of the device (see Table 17).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the following equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.
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