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參數(shù)資料
| 型號： | AD9432BSVZ-80 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 12BIT 80MSPS 52TQFP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 80M |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 1W |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 52-TQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 52-TQFP-EP（10x10） |
| 包裝： | 托盤 |
| 輸入數(shù)目和類型： | 2 個單端，單極；2 個差分，單極 |
AD9432
Rev. F | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 2.
Parameter
Rating
VDD
6 V
VCC
6 V
Analog Inputs
0.5 V to VCC + 0.5 V
Digital Inputs
0.5 V to VDD + 0.5 V
VREFIN
0.5 V to VCC + 0.5 V
Digital Output Current
20 mA
Operating Temperature Range
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
Maximum Case Temperature
150°C
Table 3 lists AD9432 thermal characteristics for simulated typical
performance in a 4-layer JEDEC board, horizontal orientation.
Table 3. Thermal Resistance
Package Type
θJA
θJMA
θJC
Unit
52-Lead LQFP (ST-52)
No Airflow
50
°C/W
52-Lead TQFP_EP (SV-52-2)1
2
°C/W
No Airflow
19.3
°C/W
1.0 m/s Airflow
16
°C/W
1 Bottom of package (soldered exposed pad).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
EXPLANATION OF TEST LEVELS
I
100% production tested.
II
100% production tested at 25°C and sample tested at
specified temperatures.
III Sample tested only.
IV Parameter is guaranteed by design and characterization
testing.
V
Parameter is a typical value only.
VI 100% production tested at 25°C; guaranteed by design and
characterization testing for industrial temperature range.
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