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參數資料
| 型號： | AD5300* |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | +2.7 V to +5.5 V. 140 uA. Rail-to-Rail Output 8-Bit DAC in an SOT-23 |
| 中文描述： | 2.7伏至5.5伏140微安。軌到軌輸出8位DAC，采用SOT - 23 |
| 文件頁數： | 3/12頁 |
| 文件大?。?/td> | 180K |
AD5300
–3–
REV. A
TIMING CHARACTERISTICS
1, 2
Limit at T
MIN
, T
MAX
V
DD
= 2.7 V to 3.6 V
Parameter
V
DD
= 3.6 V to 5.5 V
Units
Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
3
50
13
22.5
0
5
4.5
0
50
33
13
13
0
5
4.5
0
33
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
SCLK Cycle Time
SCLK High Time
SCLK Low Time
SYNC
to SCLK Rising Edge Setup Time
Data Setup Time
Data Hold Time
SCLK Falling Edge to
SYNC
Rising Edge
Minimum
SYNC
High Time
NOTES
1
All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of (V
IL
+ V
IH
)/2.
2
See Figure 1.
3
Maximum SCLK frequency is 30 MHz at V
DD
= +3.6 V to +5.5 V and 20 MHz at V
DD
= +2.7 V to +3.6 V.
Specifications subject to change without notice.
SCLK
SYNC
DIN
t
8
DB15
DB0
t
4
t
3
t
2
t
7
t
5
t
6
t
1
Figure 1. Serial Write Operation
(V
DD
= +2.7 V to +5.5 V; all specifications T
MIN
to T
MAX
unless otherwise noted)
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
°
C unless otherwise noted)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
V
OUT
to GND . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°
C to +105
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature (T
J
Max) . . . . . . . . . . . . . . . . .+150
°
C
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
J
Max–T
A
)/
θ
JA
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 240
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+220
°
C
μ
SOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
J
Max–T
A
)/
θ
JA
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206
°
C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+220
°
C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature
Range
–40
°
C to +105
°
C
–40
°
C to +105
°
C
Branding
Information Options*
Package
Model
AD5300BRT
AD5300BRM
D2B
D2B
RT-6
RM-8
*RT = SOT-23; RM =
μ
SOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5300 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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