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參數(shù)資料
| 型號(hào)： | A54SXxxA |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | FPGA |
| 英文描述： | SX-A Family FPGAs |
| 中文描述： | 的SX - A系列FPGA的 |
| 文件頁(yè)數(shù)： | 31/108頁(yè) |
| 文件大小： | 720K |
| 代理商： | A54SXXXA |
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SX-A Family FPGAs
v5.1
2-11
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient, case, or
board temperatures. This is an important distinction because dynamic and static power consumption will cause the
chip's junction to be higher than the ambient, case, or board temperatures.
EQ 2-9
and
EQ 2-10
give the relationship
between thermal resistance, temperature gradient and power.
EQ 2-9
EQ 2-10
Where:
θ
JA
T
----------------
T
A
–
P
=
θ
JA
T
-----------------
T
A
–
P
=
θ
JA
=
Junction-to-air thermal resistance
θ
JC
=
Junction-to-case thermal resistance
T
J
= Junction temperature
T
A
= Ambient temperature
T
C
= Ambient temperature
P
= total power dissipated by the device
Table 2-12
Package Thermal Characteristics
Package Type
Pin
Count
θ
JC
θ
JA
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14
33.5
27.4
25
°
C/W
Thin Quad Flat Pack (TQFP)
144
11
33.5
28
25.7
°
C/W
Thin Quad Flat Pack (TQFP)
176
11
24.7
19.9
18
°
C/W
Plastic Quad Flat Pack (PQFP)
1
208
8
26.1
22.5
20.8
°
C/W
Plastic Quad Flat Pack (PQFP) with Heat Spreader
2
208
3.8
16.2
13.3
11.9
°
C/W
Plastic Ball Grid Array (PBGA)
329
3
17.1
13.8
12.8
°
C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°
C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°
C/W
Fine Pitch Ball Grid Array (FBGA)
484
3.2
18
14.7
13.6
°
C/W
Notes:
1. The A54SX08A PQ208 has no heat spreader.
2. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| A54SX08A-1CQ208 | SX-A Family FPGAs |
| A54SX16A-1CQ208 | SX-A Family FPGAs |
| A54SX72A-1CQ208 | SX-A Family FPGAs |
| A54SX32A-1CQ208 | VENT PANEL 3U |
| A54SX08A-1CQ208A | VENT PANEL 4U |
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