2-46 Revision 13 SSTL3 Class I Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-" />
參數資料
型號: A3PE600-2FG484I
廠商: Microsemi SoC
文件頁數: 120/162頁
文件大?。?/td> 0K
描述: IC FPGA 600000 GATES 484-FBGA
標準包裝: 40
系列: ProASIC3E
RAM 位總計: 110592
輸入/輸出數: 270
門數: 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 484-BGA
供應商設備封裝: 484-FPBGA(23x23)
ProASIC3E DC and Switching Characteristics
2-46
Revision 13
SSTL3 Class I
Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). ProASIC3E devices support
Class I. This provides a differential amplifier input buffer and a push-pull output buffer.
Timing Characteristics
Table 2-72 Minimum and Maximum DC Input and Output Levels
SSTL3 Class I
VIL
VIH
VOL
VOH
IOL IOH
IOSL
IOSH
IIL IIH
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmA mA
Max.
mA1
Max.
mA1
A2 A2
14 mA
–0.3 VREF – 0.2 VREF + 0.2
3.6
0.7
VCCI – 1.1 14 14
54
51
10 10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
Figure 2-20 AC Loading
Table 2-73 AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring
Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF – 0.2
VREF + 0.2
1.5
1.485
30
Note: *Measuring point = Vtrip. See Table 2-15 on page 2-18 for a complete table of trip points.
Test Point
30 pF
50
25
SSTL3
Class I
VTT
Table 2-74 SSTL3 Class I
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 1.5 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
2.31
0.04
1.25
0.43
2.35
1.84
4.59
4.07
ns
–1
0.56
1.96
0.04
1.06
0.36
2.00
1.56
3.90
3.46
ns
–2
0.49
1.72
0.03
0.93
0.32
1.75
1.37
3.42
3.04
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
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A3PE600-2FGG256 功能描述:IC FPGA 600000 GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:ProASIC3E 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)