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參數(shù)資料
| 型號： | 935270030157 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件頁數(shù)： | 42/53頁 |
| 文件大?。?/td> | 704K |
| 代理商： | 935270030157 |
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Philips Semiconductors
SC16C650A
Universal Asynchronous Receiver/Transmitter (UART)
with 32-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 03 — 13 March 2003
47 of 49
9397 750 11207
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 29:
Suitability of IC packages for wave, reow and dipping soldering methods
Mounting
Package[1]
Soldering method
Wave
Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable[3]
suitable
Surface mount
BGA, LBGA, LFBGA,
SQFP, TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[5][6]
suitable
SSOP, TSSOP, VSO,
VSSOP
not recommended[7]
suitable
Table 30:
Revision history
Rev Date
CPCN
Description
03
20030313
-
Product data (9397 750 11207). ECN 853-2378 29622 of 07 March 2003.
Modications:
Section 6.7 on page 13, second paragraph: delete “(parallel resonant/22-33 pF load)”.
Figure 5 on page 13: capacitors’ values changed to 68 pF.
Table 8 on page 17: added shading.
Table 19 “Modem Control Register bits description” on page 24, description of bit MCR[3]:
change “INTA-INTD outputs” to “INT output”; delete references to “16 mode”.
02
20021211
-
Product data (9397 750 10812). ECN 853-2378 29261 of 06 December 2002.
01
20020910
-
Product data (9397 750 09832). ECN 853-2378 28891 of 10 September 2002.
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