參數(shù)資料
型號(hào): 7038BG
廠商: Aavid Thermalloy
文件頁數(shù): 94/116頁
文件大?。?/td> 0K
描述: BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
標(biāo)準(zhǔn)包裝: 2,000
類型: 插件板級(jí)
冷卻式包裝: Multiwatt,SIP
固定方法:
形狀: 矩形
長(zhǎng)度: 0.620"(15.75mm)
寬: 0.915"(23.24mm)
機(jī)座外的高度(散熱片高度): 0.380"(9.65mm)
溫升時(shí)的功耗: 1.5W @ 40°C
在強(qiáng)制氣流下的熱敏電阻: 在 600 LFM 時(shí)為6°C/W
自然環(huán)境下的熱電阻: 16°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
其它名稱: 032976
79
OPTIONS
&
A
C
ESSORIES
C
O
NTENT
S
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
CONTENTS
Accessories
Mounting Kits
TO-220/TO-3 Mounting Kits......................................................................................................................... 99
Insulating Shoulder Washers
Polyphenylene Sulfide (PPS) Shoulder Washers................................................................................... 100
Nylon Shoulder Washers................................................................................................................................100
Insulators
ThermalfilmTM Polymide Plastic Films........................................................................................................101
ThermalfilmTM/ ThermalfilmTM MT................................................................................................................ 102
Mica, ThermalsilTMlll.......................................................................................................................................... 103
Aluminum Oxide Ceramic Insulators........................................................................................................ 104
Stanchion Pads..................................................................................................................................................105
Insulating Covers
TO-3 Insulating Covers................................................................................................................................... 106
Teflon-Filled Acetal Insulators..................................................................................................................... 106
Teflon-Filled Acetal Bushings.......................................................................................................................106
Mounting Pads
(TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion)................ 107
Finishes .............................................................................................................................................................. 110
Card Ejectors
Snap-On Ejectors.............................................................................................................................................. 111
Standard Ejectors............................................................................................................................................. 111
Thermal Greases and Epoxies
Sil-FreeTM.............................................................................................................................................................. 112
Ther-O-LinkTM..................................................................................................................................................... 112
UltrastickTM.......................................................................................................................................................... 112
ThermalCoteTM................................................................................................................................................... 113
ThermalCoteTM II............................................................................................................................................... 113
Ther-O-BondTM 1500........................................................................................................................................ 114
Ther-O-BondTM 1600........................................................................................................................................ 114
Ther-O-BondTM 2000........................................................................................................................................ 114
ThermalbondTM.................................................................................................................................................. 115
相關(guān)PDF資料
PDF描述
5767032-3 CONN PLUG 114POS VERT .025 SMD
5767017-3 CONN PLUG 114POS VERT .025 SMD
767057-4 CONN PLUG 152POS VERT .025 SMD
SOMC160310K0JEA RES ARRAY 10K OHM 8 RES 16-SOIC
767087-4 CONN PLUG 152POS VERT .025 SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
7038L15PF 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:IDT 存儲(chǔ)容量: 組織: 訪問時(shí)間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風(fēng)格: 封裝 / 箱體: 封裝:
7038L15PF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel
7038L15PFG 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
7038L15PFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel
7038L20PF 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube