參數(shù)資料
型號： 7038BG
廠商： Aavid Thermalloy
文件頁數(shù)： 75/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準包裝： 2,000
類型： 插件板級
冷卻式包裝： Multiwatt，SIP
固定方法： 夾
形狀： 矩形
長度： 0.620"（15.75mm）
寬： 0.915"（23.24mm）
機座外的高度（散熱片高度）： 0.380"（9.65mm）
溫升時的功耗： 1.5W @ 40°C
在強制氣流下的熱敏電阻： 在 600 LFM 時為6°C/W
自然環(huán)境下的熱電阻： 16°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 032976
61
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6374
Extruded heat sink for SIP packages
Extruded heat sink for SIP
packages. Solderable pins
allow vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220, TO-218, TO-247,
and multiwatt devices.
3.96
(0.156)
2.18
(0.086)
31.75
(1.250)
38.10
(1.500)
2.92
(0.115)
17.50
(0.689)
32.00
(1.260)
16.00
(0.630)
8.00
(0.315)
DETAIL A
SEE DETAIL A
24.38
(0.960)
59.99
(2.362)
17.78
(0.700)
3.81
(0.150)
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
6374BG
Extruded heat sink with solderable pins
2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
YB32-4
High power flat back extruded channel style heat sink
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220, TO-218,
TO-247, and multiwatt devices.
2X 3.00
(0.118)
19.00
(0.748)
4.00
(0.157)
38.30
(1.508)
3.10
(0.122)
THRU
16.00
(0.630)
32.00
(1.260)
4.70
(0.185)
60.00
(2.362)
2X
32.00
(1.260)
8.00
(0.315)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
YB32-4G
High power flat back extruded heat sink
3.48 (0.137)
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
5810, 5811, 5812
Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
10.29
(0.405)
TYP 2
2.36
(0.093)
3.96
(0.156)
8.13
(0.320)
16.26
(0.640)
"A"
16.26
(0.640)
3.45
(0.136)
#6 - 32 UNC THRU
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
58110X
58100X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
58120X
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
581001B02500G
TO-218
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
581002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
581101B02500G
TO-218
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
581102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
581201B02500G
TO-218
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
581202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 85
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Pins
相關(guān)PDF資料
PDF描述
5767032-3 CONN PLUG 114POS VERT .025 SMD
5767017-3 CONN PLUG 114POS VERT .025 SMD
767057-4 CONN PLUG 152POS VERT .025 SMD
SOMC160310K0JEA RES ARRAY 10K OHM 8 RES 16-SOIC
767087-4 CONN PLUG 152POS VERT .025 SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
7038L15PF 功能描述:靜態(tài)隨機存取存儲器 RoHS:否 制造商:IDT 存儲容量: 組織: 訪問時間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風(fēng)格: 封裝 / 箱體: 封裝:
7038L15PF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel
7038L15PFG 功能描述:靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
7038L15PFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel
7038L20PF 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube
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