參數(shù)資料
型號(hào)： 7038BG
廠商： Aavid Thermalloy
文件頁數(shù)： 71/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 2,000
類型： 插件板級(jí)
冷卻式包裝： Multiwatt，SIP
固定方法： 夾
形狀： 矩形
長(zhǎng)度： 0.620"（15.75mm）
寬： 0.915"（23.24mm）
機(jī)座外的高度（散熱片高度）： 0.380"（9.65mm）
溫升時(shí)的功耗： 1.5W @ 40°C
在強(qiáng)制氣流下的熱敏電阻： 在 600 LFM 時(shí)為6°C/W
自然環(huán)境下的熱電阻： 16°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 032976
58
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
51310X
51300X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
51330X
51320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
“D” Dim
“E” Dim
513001B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513101B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513201B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513301B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513302B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63
Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144)
"A"
34.90
(1.375)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
04
8
12
16
20
8
6
2
4
0
400
200
600
800
1000
BW50
BW63
BW38
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
BW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
BW38-4G
With device mounting hole
38.00 (1.496)
Yes
3.00 (0.118)
BW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
BW50-4G
With device mounting hole
50.00 (1.968)
Yes
3.00 (0.118)
BW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
BW63-4G
With device mounting hole
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相關(guān)PDF資料
PDF描述
5767032-3 CONN PLUG 114POS VERT .025 SMD
5767017-3 CONN PLUG 114POS VERT .025 SMD
767057-4 CONN PLUG 152POS VERT .025 SMD
SOMC160310K0JEA RES ARRAY 10K OHM 8 RES 16-SOIC
767087-4 CONN PLUG 152POS VERT .025 SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
7038L15PF 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:IDT 存儲(chǔ)容量: 組織: 訪問時(shí)間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風(fēng)格: 封裝 / 箱體: 封裝:
7038L15PF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel
7038L15PFG 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
7038L15PFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel
7038L20PF 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube
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