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參數(shù)資料
| 型號： | 6MBI225U4-170 |
| 廠商： | FUJI ELECTRIC CO LTD |
| 元件分類： | IGBT 晶體管 |
| 英文描述： | IGBT MODULE |
| 中文描述： | 300 A, 1700 V, N-CHANNEL IGBT |
| 封裝： | MODULE-29 |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 519K |
| 代理商： | 6MBI225U4-170 |
H04-004-03a
MS5F6306
14
a
5
5. Thermal resistance characteristics
(*6) This is the value which is defined mounting on the additional cooling fin with thermal compound.
6.Recommend way of module mounting to Heat sink Clamping
(1) Initial : 1/3 specified torque, sequence (1)
→
(2)
→
(3)
→
(4)
→
(5)
→
(6)
→
(7)
→
(8)
(2) Final
：
Full specified torque (3.5 Nm),sequence(4)
→
(3)
→
(2)
→
(1)
→
(8)
→
(7)
→
(6)
→
(5)
7. Indication on module
Logo of production
Lot.No.
Place of manufacturing (code)
8.Applicable category
This specification is applied to IGBT Module named 6MBI225U4-170 .
9.Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% .
Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
Avoid exposure to corrosive gases and dust.
Avoid excessive external force on the module.
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
FWD
0.0167
-
-
-
0.12
0.20
-
Units
min.
-
typ.
max.
Items
Symbols
Conditions
Characteristics
225A 1700V
°C/W
6MBI225U4-170
Contact Thermal resistance
(1device) (*6)
Rth(c-f)
with Thermal Compound
Thermal resistance(1device)
Rth(j-c)
-
IGBT
(7)
(3)
(1)
(5)
(8)
(4)
(2)
(6)
Mounting holes
Heat sink
Module
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