參數(shù)資料
型號(hào): 5962-8852511YX
廠商: E2V TECHNOLOGIES PLC
元件分類: PROM
英文描述: 32K X 8 EEPROM 5V, 250 ns, CQCC32
封裝: CERAMIC, LCC-32
文件頁(yè)數(shù): 5/27頁(yè)
文件大?。?/td> 649K
代理商: 5962-8852511YX
13
0006K–PEEPR–01/08
AT28C256
27. Ordering Information(2)
27.1
Standard Package
t
ACC
(ns)
ICC (mA)
Ordering Code
Package
Operation Range
Active
Standby
150
50
0.2
AT28C256(E,F)-15JI
AT28C256(E,F)-15PI
AT28C256(E,F)-15SI
AT28C256(E,F)-15TI
32J
28P6
28S
28T
Industrial
(-40
° C to 85° C)
0.3
AT28C256(E,F)-15DM/883
AT28C256(E,F)-15FM/883
AT28C256(E,F)-15LM/883
AT28C256(E,F)-15UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55
° C to 125° C)
200
50
0.3
AT28C256(E,F)-20DM/883
AT28C256(E,F)-20FM/883
AT28C256(E,F)-20LM/883
AT28C256(E,F)-20UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55
° C to 125° C)
250
50
0.3
AT28C256(E,F)-25DM/883
AT28C256(E,F)-25FM/883
AT28C256(E,F)-25LM/883
AT28C256(E,F)-25UM/883
AT28C256(E,F)-35UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55
° C to 125° C)
Package Type
28D6
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32L
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28P6
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S
28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28-lead, Plastic Thin Small Outline Package (TSOP)
28U
28-pin, Ceramic Pin Grid Array (PGA)
W
Die
Options
Blank
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E
High Endurance Option: Endurance = 100K Write Cycles
F
Fast Write Option: Write Time = 3 ms
相關(guān)PDF資料
PDF描述
5962-8852512XX 32K X 8 EEPROM 5V, 200 ns, CDIP28
5962-8852502UX 32K X 8 EEPROM 5V, 300 ns, PGA28
5962-8852505YX 32K X 8 EEPROM 5V, 250 ns, CQCC32
5962-8852512UA 32K X 8 EEPROM 5V, 200 ns, CPGA28
5962-8854503YA 64K X 4 STANDARD SRAM, 55 ns, CDFP28
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