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參數(shù)資料
| 型號： | 58F509 |
| 英文描述： | HEATSINK |
| 中文描述： | 散熱器 |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 364K |
| 代理商： | 58F509 |
Extruded
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
G
Normally stocked
53
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
465 AND 476 SERIES
High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes
Stud-Mount
Wakefield Engineering has designed four standard heat sink types for ease of installation and
efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount
power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are
designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is avail-
able predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black
anodized.
Nominal Dimensions
Length
in. (mm)
5.000 (127.0)
6.000 (152.4)
6.000 (152.4)
Standard
P/N
465K
476K
476W
Width
in. (mm)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
Height
in. (mm)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
Hex Style
Type
1.060 in. Hex
1.250 in. Hex
1.250 in. Hex
Mounting
Hole Pattern
None
None
0.765 in.
(19.4)Dia.
Center Mount
Thermal Performance at Typical Load
Natural Convection
38°C @ 5OW
25°C @ 5OW
25°C @ 5OW
Weight
lbs. (grams)
1.9300 (875.45)
2.8200(1279.15)
2.8000(1270.08)
Forced Convection
0.27°C/W @500 LFM
0.19°C/W @500 LFM
0.19°C/W @500 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLES
K
W
476 SERIES (EXTRUSION
PROFILE 1245)
465 SERIES (EXTRUSION
PROFILE 1244)
486 AND 489 SERIES
Heat Sinks for High-Power Hex-Type Rectifiers and Diodes
Stud-Mount
Nominal Dimensions
Length
in. (mm)
6.000 (152.4)
Standard
P/N
486K
G
Width
in. (mm)
6.250 (158.8)
Height
in. (mm)
6.250 (158.8)
Hex Style
Type
1.750 in. Hex
Mounting
Hole Pattern
None
Thermal Performance at Typical Load
Natural Convection
24°C @ 50W
86°C @ 250W
19°C @ 50W
75°C @ 250W
Weight
lbs. (grams)
4.2100 (1909.66)
Forced Convection
0.20°C/W @250 LFM
0.13°C/W @500 LFM
0.15°C/W @250 LFM
0.10°C/W @500 LFM
489K
G
6.250 (158.8)
9.000 (228.6)
6.250 (158.8)
1.750 in. Hex
None
6.1400 (2785.10)
These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for
mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000
in. (50.8) area on the semiconductor base mounting surface which is free of anodize.
Material: Aluminum Alloy, Black Anodized.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
K
SEMICONDUCTOR
MOUNTING HOLE
MECHANICAL DIMENSIONS
486 AND 489 SERIES
(EXTRUSION
PROFILE 1541)
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
SERIES
486
489
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