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參數(shù)資料
| 型號： | 58F509 |
| 英文描述： | HEATSINK |
| 中文描述： | 散熱器 |
| 文件頁數(shù)： | 3/7頁 |
| 文件大?。?/td> | 364K |
| 代理商： | 58F509 |
Extruded
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
G
Normally stocked
52
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
431 AND 433 SERIES
High-Performance Heat Sinks for 30-100W Metal Power Semiconductors
Need maximum heat dissipation from a TO-3 rectifier heat sink in
minimum space The Wakefield 431 and 433 Series center chan-
nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol-
ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to
100-watt operating range. Additional interface resistance reduction for maximized overall per-
formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal
compound. Material: Aluminum Alloy, Black Anodized.
TO-3; Stud-Mount
TO-3
Nominal Dimensions
Length “A”
in. (mm)
3.000 (76.2)
5.500 (139.7)
Standard
P/N
431K
433K
G
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
Height
in. (mm)
3.000 (76.2)
3.000 (76.2)
Semiconductor
Mounting Hole Pattern Natural Convection
None
None
Thermal Performance at Typical Load
Weight
lbs. (grams)
0.7800 (353.81)
1.4900 (675.86)
Forced Convection
0.40°C/W @ 250 LFM
0.28°C/W @ 250 LFM
55°C @ 5OW
42°C @ 5OW
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
SERIES
431
433
K
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLE
431 AND 433
SERIES
(EXTRUSION
PROFILE 2726)
435 SERIES
Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles
Nominal Dimensions
Width
Length
Height
in. (mm)
in. (mm)
in. (mm)
4.250(108.0)
5.500(139.7)
4.300(109.2)
Standard
P/N
435AAAA
Semiconductor
Mounting Hole Pattern Natural Convection
(4) TO-3
Thermal Performance at Typical Load
Weight
lbs. (grams)
Forced Convection
0.38°C/W @ 250 LFM 1.1500 (521.64)
0.24°C/W @ 600 LFM
37°C @ 50W
54°C @ 80W
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLES
AAAA
441 SERIES
High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes
Stud-Mount
Nominal Dimensions
Length
in. (mm)
in. (mm)
4.750 (120.7) 5.500 (139.7) 4.500 (114.3)
Standard
P/N
441K
G
Width
Height
in. (mm)
Semiconductor
Mounting Hole Pattern
None
Thermal Performance at Typical Load
Natural Convection
34°C @ SOW
47°C @ 80W
Weight
lbs. (grams)
1.9700 (893.59)
Forced Convection
0.30°C/W @ 250 LFM
0.19°C/W @ 600 LFM
Designed for vertical mounting within a power supply enclosure
or equipment cabinet without forced airflow available. This
Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection
with a maximum 55°C heat sink temperature rise above ambient. When applied in a forced
convection environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to
ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material:
Aluminum Alloy, Black Anodized.
This lightweight high-performance heat sink is designed to
mount and cool efficiently one to four TO-3 style metal case
power semiconductors. The Type 435AAAA is the standard configuration available from stock,
predrilled for mounting four TO-3 style devices. Increased performance can be achieved with
the proper selection and installation of a Wakefield Type 175 DeltaPad Kapton interface
material for each power semiconductor or, for maximum reduction of case-to-sink interface
loss, the application of Wakefield Type 126 silicone-free thermal compound. Material:
Aluminum Alloy, Black Anodized.
435 SERIES
(EXTRUSION
PROFILE 4226)
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
441 SERIES
(EXTRUSION
PROFILE 1273)
K
Dimensions: in. (mm)
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