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參數(shù)資料
| 型號(hào)： | 58F509 |
| 英文描述： | HEATSINK |
| 中文描述： | 散熱器 |
| 文件頁數(shù)： | 1/7頁 |
| 文件大小： | 364K |
| 代理商： | 58F509 |
Extruded
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
G
Normally stocked
50
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621 AND 623 SERIES
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Natural
Convection
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
Standard
P/N
621A
621K
623A
623K
Height
in. (mm)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
Mounting
Hole Pattern
(1) TO-3
None
(1) TO-3
None
Forced
Convection
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
Weight
lbs. (grams)
0.1000 (45.36)
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
TO-3
MECHANICAL
DIMENSIONS
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
MECHANICAL
DIMENSIONS
302 AND 303 SERIES
301 SERIES
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
MECHANICAL
DIMENSIONS
641 SERIES
(EXTRUSION PROFILE 1371)
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
301/302/303 SERIES
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
Outline
Dimensions
in. (mm)
Mounting
Hole (s)
Thermal Performance at Typical Load
Natural
Convection
70°C @ 15W
70°C @ 15W
70°C @ 15W
50°C @ 15W
50°C @ 15W
5O°C @ 15W
50°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
Standard
P/N
301K
301M
301N
302M
302MM
302N
302NN
G
2.000 (50.8) x 2.000 (50.8)
303M
2.000 (50.8) x 2.000 (50.8)
303MM
2.000 (50.8) x 2.000 (50.8)
303N
G
2.000 (50.8) x 2.000 (50.8)
303NN
2.000 (50.8) x 2.000 (50.8)
Length “A”
in. (mm)
0.750 (19.1)
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1)
(1)
1
4
-28UNF, 0.625 in. thread depth
1.500 (38.1)
(1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1)
(2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1)
(1)
1
4
-28UNF, 0.625 in. thread depth
1.500 (38.1)
(2)
1
4
-28UNF, 0.625 in. thread depth
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2)
(2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2)
(1)
1
4
-28UNF, 0.625 in. thread depth
3.000 (76.2) (2)
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
Forced
Convection
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
Weight
lbs. (grams)
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
Pattern and Number
None
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
1
4
-28UNF, 0.625 in. thread depth
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
STUD-MOUNT
641 SERIES
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Outline
Dimensions
in. (mm)
Mounting
Hole
Pattern
(1) TO-3
None
Thermal Performance at Typical Load
Natural
Convection
36°C @ 15W
0.9°C/W @ 250 LFM
36°C @ 15W
0.9°C/W @ 250 LFM
Standard
P/N
641A
G
641K
G
Height
in. (mm)
1.000 (25.4)
1.000 (25.4)
Forced
Convection
Weight
lbs. (grams)
0.2900 (131.54)
0.2900 (131.54)
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
TO-3
A
K
K
S301
302
303
M
A
K
N
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