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參數(shù)資料
| 型號(hào)： | 58F509 |
| 英文描述： | HEATSINK |
| 中文描述： | 散熱器 |
| 文件頁(yè)數(shù)： | 2/7頁(yè) |
| 文件大?。?/td> | 364K |
| 代理商： | 58F509 |
Extruded
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
G
Normally stocked
51
413/421/423 SERIES
Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes
Space-saving double surface 413, 421, and 423 Series utilize finned surface
area on both sides of the power semiconductor mounting surface to provide
maximum heat dissipation in a compact profile. Ready to install on popular
power components in natural and forced convection applications. Apply
Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad
interface materials for maximum performance. Material: Aluminum Alloy, Black
Anodized.
TO-3; DO-5; Stud-Mount
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
401 AND 403 SERIES
Double-Surface Heat Sinks for TO-3 Case Styles
TO-3; Stud-Mount
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks
are recommended for critical space applications where maximum heat dissipation is required
for high-power TO-3 case styles. Forced convection performance is also exemplary with these
double surface fin types. Semiconductor mounting hole style “F” offers a single centered
0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize)
for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request.
Material: Aluminum Alloy, Black Anodized.
Standard
P/N
401A
G
401F
401K
G
403A
G
403F
G
403K
G
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
Overall Dimensions
in. (mm)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
Height
in. (mm)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
Semiconductor
Mounting Hole Pattem
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
Thermal Performance at Typical Load
Natural Convection
80°C @ 30W
80°C @ 30W
80°C @ 30W
55°C @ 30W
55°C @ 30W
55°C @ 30W
Weight
lbs. (grams)
0.1500 (68.04)
0.1500 (68.04)
0.1500 (68.04)
0.3500 (158.76)
0.3500 (158.76
0.3500 (158.76)
Forced Convection
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
403 SERIES
A
F
K
V
401 SERIES
401 AND 403 SERIES
(EXTRUSION
PROFILE 1024)
413 SERIES
(EXTRUSION
PROFILE 2276
421 SERIES
(EXTRUSION
PROFILE 1025)
SERIES
413
421
423 SERIES
(EXTRUSION PROFILE 1025)
A
F
K
V
Nominal Dimensions
Length
in. (mm)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
5.500 (140.2)
5.500 (140.2)
Standard
P/N
413A
413F
413K
G
421A
421F
421K
G
423A
423K
G
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
Height “A”
in. (mm)
1.875 (47.6)
1.875 (47.6)
1.875 (47.6)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
Semiconductor
Mounting Hole Pattern Natural Convection
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
None
Thermal Performance at Typical Load
Weight
lbs. (grams)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
1.1700 (530.71)
1.1700 (530.71)
Forced Convection
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.5°C/W @ 250 LFM
0.5°C/W @ 250 LFM
72°C @ 50W
72°C @ 50W
72°C @ 50W
58°C @ 50W
58°C @ 50W
58°C @ 50W
47°C @ 50W
47°C @ 50W
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
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